During power or current limiting, there is a power dissipation [(V_IN – V_OUT) × I_OUT] in the internal FET of the device. Due to this power dissipation, the temperature (T_J) of device increases. When the device temperature increases above T_TSD, it shuts down. After the thermal shutdown, the TPS16411, TPS16413, TPS16415, and TPS16417 remain latched. To reset the latch, toggle EN/SHDN or recycle the Vcc supply. To reset the latch, keep EN/SHDN pin low for duration more than t_{Low_SHDN}.

After thermal shutdown, the TPS16410, TPS16412, TPS16414, and TPS16416 devices wait for temperature to go below [T_TSD – T_TSD-hyst] and then the device restarts after a delay of t_retry.