SLVSHA1 September   2024 TPS1685

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Logic Interface
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Undervoltage Protection
      2. 7.3.2  Insertion Delay
      3. 7.3.3  Overvoltage Protection
      4. 7.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 7.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 7.3.4.1.1 Start-Up Time Out
        2. 7.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 7.3.4.3 Active Current Limiting During Start-Up
        4. 7.3.4.4 Short-Circuit Protection
      5. 7.3.5  Analog Load Current Monitor (IMON)
      6. 7.3.6  Mode Selection (MODE)
      7. 7.3.7  Parallel Device Synchronization (SWEN)
      8. 7.3.8  Stacking Multiple eFuses for Unlimited Scalability
        1. 7.3.8.1 Current Balancing During Start-Up
      9. 7.3.9  Analog Junction Temperature Monitor (TEMP)
      10. 7.3.10 Overtemperature Protection
      11. 7.3.11 Fault Response and Indication (FLT)
      12. 7.3.12 Power Good Indication (PG)
      13. 7.3.13 Output Discharge
      14. 7.3.14 FET Health Monitoring
      15. 7.3.15 Single Point Failure Mitigation
        1. 7.3.15.1 IMON Pin Single Point Failure
        2. 7.3.15.2 IREF Pin Single Point Failure
        3. 7.3.15.3 ITIMER Pin Single Point Failure
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single Device, Standalone Operation
      2. 8.1.2 Multiple Devices, Parallel Connection
    2. 8.2 Typical Application: 54V Power Path Protection in Data Center Servers
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Transient Protection
      2. 8.3.2 Output Short-Circuit Measurements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

封装选项

机械数据 (封装 | 引脚)
  • VMA|23
散热焊盘机械数据 (封装 | 引脚)
订购信息

5 Pin Configuration and Functions

Figure 5-1 TPS1685x VMA Package, QFN 23-Pin (Top View)
Table 5-1 Pin Functions
PINTYPE(1)DESCRIPTION
NAMENO.
ILIM1I/OAn external resistor from this pin to GND sets the active current sharing threshold during steady-state. This pin also serves as individual eFuse current monitor output during steady state. Do not leave floating.
IMON2I/OAn external resistor from this pin to GND sets the overcurrent protection threshold and fast-trip threshold during steady-state. This pin also acts as a fast and accurate analog output load current monitor signal during steady-state. Do not leave floating.
IREF3I/OThis pin sets the reference voltage for overcurrent, short-circuit protection and active current sharing blocks. The reference voltage can be generated using internal current source and resistor on this pin, or can be driven from external voltage source. Do not leave floating.
dVdT4I/OThis pin is used to configure the output slew rate during Start-up. Leave this pin open to allow fastest start-up. Connect capacitor to ground to slow down the slew rate to manage inrush current.
GND5GDevice ground reference pin. Connect to system ground.
SFT_SEL6I/OThis pin selects the scalable fast trip threshold multiplier during steady state. Connect a resistor from this pin to GND to select the SFT multiplier.
OUT7, 8PPower output. Must be soldered to the output power plane uniformly for proper heat dissipation.
VDD9PController power input pin. Can be used to power the internal control circuitry with a filtered and stable supply which is not affected by system transients. Connect this pin to VIN through a series resistor and add a decoupling capacitor to GND.
IN10, 22, 23PPower input. Must be soldered to the input power plane uniformly for proper heat dissipation.
NC11, 17, 21—Do not connect anything to this pin.
MODE12IThis pin is used to configure the device for standalone/primary or secondary mode. Connect the pin to GND to configure device as a secondary to a primary eFuse/controller. Leave the pin floating for standalone/primary mode of operation.
FLT13OThis is an open drain active low pin which is pulled low to indicate a fault. Pull up this pin to external supply voltage with a resistor.
ITIMER14I/OA capacitor from this pin to GND sets the overcurrent blanking interval during which the output current can temporarily exceed the overcurrent threshold (but lower than fast-trip threshold) during steady-state operation before the device overcurrent response takes action.
TEMP15I/OAnalog voltage output for junction temperature. Can be tied together with TEMP outputs of multiple devices in a parallel configuration to indicate the peak temperature of the parallel chain.
EN/UVLO16IActive high enable input. Connect resistor divider from input supply to set the undervoltage threshold. Do not leave floating.
OVP18IThis pin can be used to set the over-voltage set-point. Connect a resistor divider from VIN to this pin. Do not leave floating.
PGOOD19OThis is an open-drain active high power good pin which is asserted high when the device is in steady state. This pin has weak internal pull-up to internal supply voltage.
SWEN20I/OThis is an open-drain signal to indicate and control power switch ON/OFF status. This pin facilitates active synchronization between multiple devices in a parallel chain. This pin has weak internal pull-up to internal supply voltage.
INPowerPadPPower input. Must be soldered to the input power plane uniformly for proper heat dissipation.
(1) I = Input, O = Output, I/O = Input or Output, G = Ground, P = Power.
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