ZHCSHN4D February   2018  – September 2021 TPS1H200A-Q1

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Current limit
      2. 7.3.2 DELAY Pin Configuration
        1. 7.3.2.1 Holding Mode
        2. 7.3.2.2 Latch-Off Mode
        3. 7.3.2.3 Auto-Retry Mode
      3. 7.3.3 Stand-alone Operation
      4. 7.3.4 Fault Truth Table
      5. 7.3.5 Full Diagnostics
        1. 7.3.5.1 Short-to-GND and Overload Detection
        2. 7.3.5.2 Open-Load Detection
          1. 7.3.5.2.1 Output On
          2. 7.3.5.2.2 Output Off
        3. 7.3.5.3 Short-to-Battery Detection
        4. 7.3.5.4 Thermal Fault Detection
          1. 7.3.5.4.1 Thermal Shutdown
          2. 7.3.5.4.2 Thermal Swing
          3. 7.3.5.4.3 Fault Report Holding
      6. 7.3.6 Full Protections
        1. 7.3.6.1 UVLO Protection
        2. 7.3.6.2 Inductive Load Switching Off Clamp
        3. 7.3.6.3 Loss-of-GND Protection
        4. 7.3.6.4 Loss-of-Power-Supply Protection
        5. 7.3.6.5 Reverse-Current Protection
        6. 7.3.6.6 MCU I/O Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Working Modes
        1. 7.4.1.1 Normal Mode
        2. 7.4.1.2 Standby Mode
        3. 7.4.1.3 Standby Mode With Diagnostics
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)(2)
MINMAXUNIT
Supply voltage VS pint < 400 ms—42V
Reverse polarity voltage (3)t < 1 minute–36—V
Current on GNDt < 2 minutes–100250mA
Voltage on IN and DIAG_EN pins–0.3VSV
Current on IN and DIAG_EN pins–10—mA
Voltage on DELAY pin–0.37V
Current on DELAY pin–60—mA
Voltage on FAULT pin–0.37V
Current on FAULT pin–3010mA
Voltage on CL pin–0.37V
Current on CL pin—6mA
Voltage on OUT pin—42V
Inductive load switch-off energy dissipation single pulse(4)—40mJ
Operating junction temperature, TJ–40150°C
Storage temperature, Tstg–65150°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to ground.
(3) Reverse polarity condition: VIN = 0 V, reverse current < IR(2), GND pin 1-kΩ resistor in parallel with diode.
(4) Test condition: VVS = 13.5 V, L = 8 mH, TJ = 150°C. FR4 2s2p board, 2 × 70-μm Cu, 2 × 35-μm Cu. 600 mm2 thermal pad copper area.
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