米6体育平台手机版

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		D (SOIC)		DBV (SOT-23)	DGN (HVSSOP)	DRB (SON)	UNIT
THERMAL METRIC⁽¹⁾		8 PINS	16 PINS	5 PINS	8 PINS	8 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	119.3	81.6	208.6	53.6	47.5	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	67.6	42.7	122.9	58.7	53	°C/W
R_θJB	Junction-to-board thermal resistance	59.6	39.1	37.8	35.5	14.2	°C/W
ψ_JT	Junction-to-top characterization parameter	20.3	10.4	14.6	2.7	1.2	°C/W
ψ_JB	Junction-to-board characterization parameter	59.1	38.8	36.9	35.3	14.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	6.7	7.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.