TI recommends placing a 0.01-µF to 0.1-µF ceramic bypass capacitor between IN and GND, close to the device. When the output load is heavy, TI recommends placing a high-value electrolytic capacitor on the necessary output pins. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients.