ZHCSRR9K December 2003 – June 2024 TPS2061 , TPS2062 , TPS2063 , TPS2065 , TPS2066 , TPS2067
PRODUCTION DATA
请参考 PDF 数据表获取器件具体的封装图。
| THERMAL METRIC(1) | D (SOIC) |
DBV (SOT-23) |
DGN (HVSSOP) |
UNIT | ||
|---|---|---|---|---|---|---|
| 8 PINS | 16 PINS | 5 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 119.3 | 81.6 | 208.6 | 53.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 67.6 | 42.7 | 122.9 | 58.7 | °C/W |
| RθJB | Junction-to-board thermal resistance | 59.6 | 39.1 | 37.8 | 35.5 | °C/W |
| ψJT | Junction-to-top characterization parameter | 20.3 | 10.4 | 14.6 | 2.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 59.1 | 38.8 | 36.9 | 35.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | N/A | N/A | 6.7 | °C/W |