SLVSA01C May 2011 – June 2016 TPS2062-Q1 , TPS2065-Q1
PRODUCTION DATA.
| PINS | TYPE | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| EN1 | 3 | I | Enable input, logic low (active low) turns on power switch IN-OUT1 |
| EN2 | 4 | I | Enable input, logic low (active low) turns on power switch IN-OUT2 |
| GND | 1 | GND | Ground |
| IN | 2 | PWR | Supply Input voltage |
| OC1 | 8 | O | Overcurrent, open-drain output, active low, IN-OUT1 |
| OC2 | 5 | O | Overcurrent, open-drain output, active low, IN-OUT2 |
| OUT1 | 7 | O | Power-switch output, IN-OUT1 |
| OUT2 | 6 | O | Power-switch output, IN-OUT2 |
| Thermal Pad | — | GND | Internally connected to GND; used to heat-sink the part to the circuit board ground plane, also calledPowerPAD™ or exposed thermal pad. Must be connected to GND pin. |
| PINS | TYPE | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| EN | 4 | I | Enable input, logic high (active high) turns on power switch IN-OUT |
| GND | 1 | GND | Ground |
| IN | 2, 3 | PWR | Supply Input voltage |
| OC | 5 | O | Overcurrent, open-drain output, active low, IN-OUT |
| OUT | 6, 7, 8 | O | Power-switch output, IN-OUT |
| Thermal Pad | — | GND | Internally connected to GND; used to heat-sink the part to the circuit board ground plane, also called PowerPAD™ or exposed thermal pad. Must be connected to GND pin. |