TI recommends using a 0.01-μF to 0.1-μF ceramic bypass capacitor between IN and GND, close to the device. TI recommends placing a high-value electrolytic capacitor on the output pin(s) when the output load is heavy. This precaution reduces power-supply transients that may cause ringing on the input. Additionally, bypassing the output with a 0.01-μF to 0.1-μF ceramic capacitor improves the immunity of the device to short-circuit transients.