ZHCSCL6 July   2014 TPS2105-EP

PRODUCTION DATA.  

  1. 特性
  2. 应用范围
  3. 说明
  4. 修订历史记录
  5. Pin Configuration and Functions
    1. 5.1 Function Table
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Power Switches
        1. 7.3.1.1 N-Channel MOSFET
        2. 7.3.1.2 P-Channel MOSFET
        3. 7.3.1.3 Charge Pump
        4. 7.3.1.4 Driver
        5. 7.3.1.5 Enable
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With EN Control
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step-by-Step Design Procedure
        2. 8.2.2.2 Power-Supply Considerations
        3. 8.2.2.3 Switch Transition
        4. 8.2.2.4 Thermal Protection
        5. 8.2.2.5 Undervoltage Lockout
        6. 8.2.2.6 Power Dissipation and Junction Temperature
        7. 8.2.2.7 ESD Protection
      3. 8.2.3 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11器件和文档支持
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 术语表
  12. 12机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 Trademarks

All other trademarks are the property of their respective owners.

11.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.3 术语表

SLYZ022TI 术语表

这份术语表列出并解释术语、首字母缩略词和定义。