ZHCSHY9 April   2018 TPS22810-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     简化原理图
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical DC Characteristics
    8. 6.8 Typical AC Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 On and Off Control
      2. 8.3.2 Quick Output Discharge (QOD)
        1. 8.3.2.1 QOD when System Power is Removed
        2. 8.3.2.2 Internal QOD Considerations
      3. 8.3.3 EN/UVLO
      4. 8.3.4 Adjustable Rise Time (CT)
      5. 8.3.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 ON and OFF Control
      2. 9.1.2 Input Capacitor (Optional)
      3. 9.1.3 Output Capacitor (Optional)
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Shutdown Sequencing During Unexpected Power Loss
        2. 9.2.2.2 VIN to VOUT Voltage Drop
        3. 9.2.2.3 Inrush Current
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12器件和文档支持
    1. 12.1 器件支持
      1. 12.1.1 开发支持
    2. 12.2 文档支持
      1. 12.2.1 相关文档
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.6 Switching Characteristics

Refer to the timing test circuit in Figure 16 (unless otherwise noted) for references to external components used for the test condition in the switching characteristics table. Switching characteristics shown below are only valid for the power-up sequence where VIN is already in steady state condition before the EN/UVLO pin is asserted high.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIN = 18 V, VEN/UVLO = 5 V, TA = 25 °C (unless otherwise noted)
tON Turnon time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 520 µs
tOFF Turnoff time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 3.3
tR VOUT rise time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 700
tF VOUT fall time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 2
tD Delay time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 180
VIN = 12 V, VEN/UVLO = 5 V, TA = 25 °C (unless otherwise noted)
tON Turnon time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 380 µs
tOFF Turnoff time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 3.3
tR VOUT rise time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 460
tF VOUT fall time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 2
tD Delay time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 150
VIN = 3.3 V, VEN/UVLO = 5 V, TA = 25 °C (unless otherwise noted)
tON Turnon time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 185 µs
tOFF Turnoff time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 3.3
tR VOUT rise time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 120
tF VOUT fall time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 2
tD Delay time RL = 10 Ω, CIN = 1 µF, CL = 0.1 µF, CT = 2200 pF 130
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