SLVS832D November   2008  – July 2014 TPS22941 , TPS22942 , TPS22943 , TPS22944 , TPS22945

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fault Reporting
      2. 8.3.2 Current Limiting
      3. 8.3.3 Thermal Shutdown
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 On/Off Control
      2. 9.1.2 Undervoltage Lockout
      3. 9.1.3 Reverse Voltage
      4. 9.1.4 Input Capacitor
      5. 9.1.5 Output Capacitor
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 VIN to VOUT Voltage Drop
        2. 9.2.2.2 Maximum Output Capacitance
        3. 9.2.2.3 Power Dissipation
        4. 9.2.2.4 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Trademarks
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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7 Specifications

7.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
VI Input voltage range VIN, VOUT, ON –0.3 6 V
TJ Operating junction temperature range Internally Limited °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
VESD Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) –4 4 kV
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) –1 1
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN Input voltage 1.62 5.5 V
VOUT Output voltage VIN
TA Ambient free-air temperature –40 85 °C

7.4 Thermal Information

THERMAL METRIC(1) TPS22941/2/3/4/5 UNIT
DCK
5 PINS
θJA Junction-to-ambient thermal resistance 294 °C/W
θJC(top) Junction-to-case (top) thermal resistance 59.2
θJB Junction-to-board thermal resistance 95.4
ψJT Junction-to-top characterization parameter 0.7
ψJB Junction-to-board characterization parameter 93.9
θJC(bot) Junction-to-case (bottom) thermal resistance N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

VIN = 1.62 V to 5.5 V, TA = –40°C to 85°C (unless otherwise noted)
PARAMETER TEST CONDITIONS TA MIN TYP(1) MAX UNIT
IIN Quiescent current IOUT = 0 mA, VIN = 1.62 V to 5.5 V Full 40 80 μA
IIN(OFF) OFF-State supply current VON = 0 V (TPS22943/4/5)
or
VON = VIN (TPS22941/2)		 VIN = 3.6 V,
VOUT open 		Full 1 μA
IOUT(LEAKAGE) OFF-State switch current VON = 0 V (TPS22943/4/5)
or
VON = VIN (TPS22941/2)		 VIN = 3.6 V,
VOUT short to GND 		Full 1 μA
rON ON-state resistance IOUT = 20 mA VIN = 5.5 V 25°C 0.4 0.5 Ω
Full 0.6
VIN = 3.3 V 25°C 0.5 0.6
Full 0.7
VIN = 2.5 V 25°C 0.6 0.7
Full 0.8
VIN = 1.8 V 25°C 0.8 0.9
Full 1.1
VIN = 1.62 V 25°C 0.9 1.1
Full 1.2
ION ON input leakage current VON = VIN or GND Full 1 μA
ILIM Current limit VIN = 3.3 V, VOUT = 3 V TPS22941/3 Full 40 65 80 mA
TPS22942/4/5 100 150 200
TSD Thermal shutdown Shutdown threshold Full 140 °C
Return from shutdown 130
Hysteresis 10
UVLO Undervoltage shutdown VIN increasing Full 1.32 1.42 1.52 V
Undervoltage shutdown hysteresis Full 45 mV
Control Output (OC)
Vol OC output logic low voltage VIN = 5 V, ISINK = 10 mA Full 0.1 0.2 V
VIN = 1.8 V, ISINK = 10 mA 0.1 0.3
Ioz OC output high leakage current voltage VIN = 5 V, Switch ON Full 0.5 μA
Control Input (ON)
Vih ON high-level input voltage VIN = 1.8 V Full 1.1 V
VIN = 2.5 V Full 1.3 V
VIN = 3.3 V Full 1.4 V
VIN = 5.5 V Full 1.7 V
Vil ON low-level input voltage VIN = 1.8 V Full 0.5 V
VIN = 2.5 V Full 0.7 V
VIN = 3.3 V Full 0.8 V
VIN = 5.5 V Full 0.9 V
Ii ON high-level input leakage current VIN = 1.8 V to 5 V, Switch ON Full 1 μA
(1) Typical values are at VIN = 3.3 V and TA = 25°C.

7.6 Switching Characteristics

VIN = 3.3 V, RL = 500 Ω, CL = 0.1 μF, TA = 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tON Turn-ON time RL = 500 Ω, CL = 0.1 μF 60 μs
tOFF Turn-OFF time RL = 500 Ω, CL = 0.1 μF 30 μs
tr VOUT rise time RL = 500 Ω, CL = 0.1 μF 10 μs
tf VOUT fall time RL = 500 Ω, CL = 0.1 μF 90 μs
tBLANK Over current blanking time TPS22941/2/5 5 10 20 ms
tRSTART Auto-restart time TPS22941/2/5 40 80 160 ms
Short-circuit response time VIN = VON = 3.3 V, moderate overcurrent condition 9 μs
VIN = VON = 3.3 V, hard short 4 μs

7.7 Typical Characteristics

g_ron_vin_lvs832.gifFigure 1. rON vs VIN
g_qui_vin_lvs832.gifFigure 3. Quiescent Current vs VIN
g_iinleak_ta_lvs832.gifFigure 5. IIN(Leakage) vs Temperature
g_iinoff_ta_lvs832.gifFigure 7. IIN(off) vs Temperature
g_ioutleak_ta_lvs832.gifFigure 9. IOUT(leakage) vs Temperature
g_ilim_vin_lvs832.gifFigure 11. ILIM vs Output Voltage (TPS22942, TPS22944, TPS22945)
g_ilim_vin_vout_41_43_lvs832.gifFigure 13. ILIM vs (VIN-VOUT) (TPS22941, TPS22943)
g_tristfall_ta_lvs832.gif
CL = 0.1 µF RL = 350 Ω VIN = 3.3 V
Figure 15. trise/tfall vs Temperature
g_tblank_ta_lvs832.gifFigure 17. tBLANK vs Temperature (VIN = 3.3 V)
g_ron_ta_lvs832.gifFigure 2. rON vs Temperature
g_qui_ta_lvs832.gifFigure 4. Quiescent Current vs Temperature
g_iinleak_vin_lvs832.gifFigure 6. IIN(Leakage) vs VIN
g_iinoff_vin_lvs832.gifFigure 8. IIN(off) vs VIN
g_oninputthres_lvs832.gifFigure 10. VOUT vs ON Threshold
g_ilim_ta_lvs832.gifFigure 12. ILIM vs Temperature (TPS22942, TPS22944, TPS22945)
g_ilim_temp_41_43_lvs832.gifFigure 14. ILIM vs Temperature (TPS22941, TPS22943)
g_tontoff_ta_lvs832.gif
CL = 0.1 µF RL = 350 Ω VIN = 3.3 V
Figure 16. tON/tOFF vs Temperature
g_trestart_ta_lvs832.gifFigure 18. tRESTART vs Temperature (VIN = 3.3 V)
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