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ZHCSUV3E April 2009 – April 2024 TPS22960

PRODUCTION DATA

5.4 Thermal Information

THERMAL METRIC⁽¹⁾		DCN (SOT)	RSE (UQFN)	UNIT
THERMAL METRIC⁽¹⁾		8 PINS	8 PINS	UNIT
R_θJA	Junction-to-ambient thermal resistance	254	124	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	122	67	°C/W
R_θJB	Junction-to-board thermal resistance	181	31.5	°C/W
ψ_JT	Junction-to-top characterization parameter	22	2.9	°C/W
ψ_JB	Junction-to-board characterization parameter	178	31.5	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	—	°C/W

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics (SPRA953).