13.1 Layout Guidelines

For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT and GND will help minimize the parasitic electrical effects.

For higher reliability, the maximum IC junction temperature, T_J(max), should be restricted to 125˚C under normal operating conditions. Junction temperature is directly proportional to power dissipation in the device and the two are related by Equation 4.

Equation 4.

where

• T_J = Junction temperature of the device
• T_A = Ambient temperature
• P_D = Power dissipation inside the device
• Ө_JA = Junction to ambient thermal resistance. See Thermal Information section of the datasheet. This parameter is highly dependent on board layout.

13.2 Layout Example

Figure 43. Layout Example