SLVSBH4F June   2012  – July 2016 TPS22966

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics—VBIAS = 5 V
    6. 6.6 Electrical Characteristics—VBIAS = 2.5 V
    7. 6.7 Switching Characteristics
    8. 6.8 Typical DC Characteristics
    9. 6.9 Typical AC Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 ON and OFF Control
      2. 8.3.2 Input Capacitor (Optional)
      3. 8.3.3 Output Capacitor (Optional)
      4. 8.3.4 VIN and VBIAS Voltage Range
    4. 8.4 Device Functional Modes
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Adjustable Rise Time
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.

9.1 Application Information

This application demonstrates how the TPS22966 can be used to limit inrush current when powering on downstream modules.

9.2 Typical Application

TPS22966 typ_app_lvsbh4.gif Figure 33. Typical Application Circuit

9.2.1 Design Requirements

Table 2 shows the TPS22966 desgin parameters.

Table 2. Design Parameters

DESIGN PARAMETER VALUE
Input voltage 3.3 V
Bias voltage 5 V
Load capacitance (CL) 22 µF
Maximum acceptable inrush current 400 mA

9.2.2 Detailed Design Procedure

When the switch is enabled, the output capacitors must be charged up from 0 V to the set value (3.3 V in this example). This charge arrives in the form of inrush current. Inrush current can be calculated using Equation 1.

Equation 1. Inrush Current = C × dV/dt

where

  • C is the output capacitance
  • dV is the output voltage
  • dt is the rise time

The TPS22966 offers adjustable rise time for VOUT. This feature allows the user to control the inrush current during turnon. The appropriate rise time can be calculated using Table 2 and Equation 1 as shown in Equation 2.

Equation 2. 400 mA = 22 μF × 3.3 V/dt
Equation 3. dt = 181.5 μs

To ensure an inrush current of less than 400 mA, choose a CT value that yields a rise time of more than 181.5 μs. See the oscilloscope captures in the Application Curves section for an example of how the CT capacitor can be used to reduce inrush current.

9.2.2.1 Adjustable Rise Time

A capacitor to GND on the CTx pins sets the slew rate for each channel. To ensure desired performance, a capacitor with a minimum voltage rating of 25 V must be used on the CTx pin. An approximate formula for the relationship between CTx and slew rate is given in Equation 4. Equation 4 accounts for 10% to 90% measurement on VOUT and does NOT apply for CTx = 0 pF. (Use Table 3 to determine rise times for when CTx = 0 pF).

Equation 4. TPS22966 eq1_lvsbh4.gif

where

  • SR is the slew rate (in µs/V)
  • CT is the capacitance value on the CTx pin (in pF)
  • The units for the constant 13.7 is in µs/V.

Rise time can be calculated by multiplying the input voltage by the slew rate. Table 3 shows rise time values measured on a typical device. Rise times shown in Table 3 are only valid for the power-up sequence where VIN and VBIAS are already in steady state condition, and the ON pin is asserted high.

Table 3. Rise Time Values

CTx (pF) RISE TIME (µs) 10% - 90%, CL = 0.1µF, CIN = 1µF, RL = 10Ω
(1)
5 V 3.3 V 1.8 V 1.5 V 1.2 V 1.05 V 0.8 V
0 124 88 63 60 53 49 42
220 481 323 193 166 143 133 109
470 855 603 348 299 251 228 175
1000 1724 1185 670 570 469 411 342
2200 3328 2240 1308 1088 893 808 650
4700 7459 4950 2820 2429 1920 1748 1411
10000 16059 10835 6040 5055 4230 3770 3033
(1) TYPICAL VALUES at 25°C, VBIAS = 5 V, 25 V X7R 10% CERAMIC CAP.

9.2.3 Application Curves

TPS22966 InrushCurrentwithCT0pF.png
VBIAS = 5 V VIN = 3.3 V CL = 22 μF
Figure 34. Inrush Current with CT = 0 pF
TPS22966 InrushCurrentwithCT220pF.png
VBIAS = 5 V VIN = 3.3 V CL = 22 μF
Figure 35. Inrush Current with CT = 220 pF