ZHCSFR3D November   2016  – December 2023 TPS22976

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
    1.     Pin Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (VBIAS = 5V)
    6. 6.6  Electrical Characteristics (VBIAS = 2.5V)
    7. 6.7  Switching Characteristics (TPS22976)
    8. 6.8  Switching Characteristics (TPS22976A)
    9. 6.9  Switching Characteristics (TPS22976N)
    10. 6.10 Typical DC Characteristics
    11. 6.11 Typical AC Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 ON and OFF Control
      2. 8.3.2 Input Capacitor (Optional)
      3. 8.3.3 Output Capacitor (Optional)
      4. 8.3.4 Quick Output Discharge (QOD) (Not Present in TPS22976N)
      5. 8.3.5 Thermal Shutdown
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Parallel Configuration
      2. 9.1.2 Standby Power Reduction
      3. 9.1.3 Power Supply Sequencing without GPIO Input
      4. 9.1.4 Reverse Current Blocking
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inrush Current
        2. 9.2.2.2 Adjustable Rise Time
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
      3. 9.4.3 Power Dissipation
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Developmental Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

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机械数据 (封装 | 引脚)
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订购信息

9.4.2 Layout Example

Notice the thermal vias located under the exposed thermal pad of the device. This allows for thermal diffusion away from the device.

GUID-70A69FCF-4930-45C2-9839-6A999E287308-low.gifFigure 9-8 PCB Layout Example
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