ZHCSLK0A July   2021  – December 2021 TPS22992

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics (VBIAS = 5 V)
    6. 7.6  Electrical Characteristics (VBIAS = 3.3 V)
    7. 7.7  Electrical Characteristics (VBIAS = 1.5 V)
    8. 7.8  Switching Characteristics (VBIAS = 5 V)
    9. 7.9  Switching Characteristics (VBIAS = 3.3 V)
    10. 7.10 Switching Characteristics (VBIAS = 1.5 V)
    11. 7.11 Typical Characteristics
  8. 8 Timing Diagram
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 ON and OFF Control
      2. 9.3.2 Adjustable Quick Output Discharge
      3. 9.3.3 Adjustable Slew Rate
      4. 9.3.4 Power Good (PG) Signal
      5. 9.3.5 Thermal Shutdown
      6. 9.3.6 Short Circuit Protection (TPS22992S)
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Performance Plots
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 接收文档更新通知
    2. 13.2 支持资源
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 术语表
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • RXN|8
  • RXP|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC (1) TPS22992 UNIT
RXP (WQFN) RXN (WQFN)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 110.0 119.4 °C/W
ΨJT Junction-to-top characterization parameter 6.8 6.9 °C/W
YJB Junction-to-board characterization parameter 36.6 35.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |