ZHCSMU0D July   2009  – December 2020 TPS23753A

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Product Information
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: Controller Section Only
    6. 7.6 Electrical Characteristics: PoE and Control
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Description
        1. 8.3.1.1  APD
        2. 8.3.1.2  BLNK
        3. 8.3.1.3  CLS
        4. 8.3.1.4  CS
        5. 8.3.1.5  CTL
        6. 8.3.1.6  DEN
        7. 8.3.1.7  FRS
        8. 8.3.1.8  GATE
        9. 8.3.1.9  RTN
        10. 8.3.1.10 VB
        11. 8.3.1.11 VC
        12. 8.3.1.12 VDD
        13. 8.3.1.13 VDD1
        14. 8.3.1.14 VSS
    4. 8.4 Device Functional Modes
      1. 8.4.1  Threshold Voltages
      2. 8.4.2  PoE Start-Up Sequence
      3. 8.4.3  Detection
      4. 8.4.4  Hardware Classification
      5. 8.4.5  Maintain Power Signature (MPS)
      6. 8.4.6  TPS23753A Operation
        1. 8.4.6.1 Start-Up and Converter Operation
        2. 8.4.6.2 PD Self-Protection
        3. 8.4.6.3 Converter Controller Features
      7. 8.4.7  Special Switching MOSFET Considerations
      8. 8.4.8  Thermal Considerations
      9. 8.4.9  FRS and Synchronization
      10. 8.4.10 Blanking – RBLNK
      11. 8.4.11 Current Slope Compensation
      12. 8.4.12 Adapter ORing
      13. 8.4.13 Protection
      14. 8.4.14 Frequency Dithering for Conducted Emissions Control
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Support Resources
    3. 12.3 Electrostatic Discharge Caution
    4. 12.4 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4.8 Thermal Considerations

Sources of nearby local PCB heating must be considered during the thermal design. Typical calculations assume that the TPS23753A is the only heat source contributing to the PCB temperature rise. It is possible for a normally operating TPS23753A device to experience an OTSD event if it is excessively heated by a nearby device.
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