ZHCS981A JUNE   2012  – August 2016 TPS2511

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overcurrent Protection
      2. 7.3.2 Current Limit Threshold
      3. 7.3.3 Current-Sensing Report (CS)
      4. 7.3.4 Undervoltage Lockout (UVLO) and Enable (EN)
      5. 7.3.5 Soft Start, Reverse Blocking, and Discharge Output
      6. 7.3.6 Thermal Sense
      7. 7.3.7 VBUS Voltage Drop Compensation
      8. 7.3.8 Divide Mode Selection of 5-W and 10-W USB Chargers
    4. 7.4 Device Functional Modes
      1. 7.4.1 Dedicated Charging Port (DCP)
        1. 7.4.1.1 Short the D+ Line to the D- Line
        2. 7.4.1.2 Divider1 (DCP Applying 2 V on D+ Line and 2.7 V on D- Line) or Divider2 (DCP Applying 2.7 V on D+ Line and 2 V on D- Line)
        3. 7.4.1.3 Applying 1.2 V to the D+ Line and 1.2 V to the D- Line
      2. 7.4.2 DCP Auto-Detect
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input and Output Capacitance
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 文档支持
      1. 11.1.1 相关文档
    2. 11.2 接收文档更新通知
    3. 11.3 社区资源
    4. 11.4 商标
    5. 11.5 静电放电警告
    6. 11.6 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage IN Supply voltage –0.3 7 V
EN, ILIM_SET Input voltage –0.3 7
OUT, CS –0.3 7
IN to OUT –7 7
DP output voltage DM output –0.3 IN+0.3 or 5.7
DP input voltage DM input –0.3 IN+0.3 or 5.7
Current DP input current, DM input current Continuous output sink current 35 mA
DP output current, DM output current Continuous output source current 35
CS Continuous output sink current 10
ILIM_SET Continuous output source current Internally limited
Temperature Operating junction temperature, TJ Internally limited
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins except 6 and 7 ±2000 V
Pins 6 and 7 ±7500
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

voltages are referenced to GND (unless otherwise noted), positive current are into pins.
MIN MAX UNIT
VIN Input voltage of IN 4.5 5.5 V
VCS Input voltage of CS 0 5.5
VEN Input voltage of EN 0 5.5
VDP DP data line input voltage 0 5.5
VDM DM data line input voltage 0 5.5
IDP Continuous sink/source current ±10 mA
IDM Continuous sink/source current ±10
ICS Continuous sink current 2
IOUT Continuous output current of OUT 2.2 A
RILIM_SET A resistor of current limit, ILIM_SET to GND 16.9 750 kΩ
TJ Operating junction temperature –40 125 ºC

6.4 Thermal Information

THERMAL METRIC(1) TPS2511 UNIT
DGN
(MSOP-PowerPAD)
8 PINS
RθJA Junction-to-ambient thermal resistance 65.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 53.3 °C/W
RθJB Junction-to-board thermal resistance 36.9 °C/W
ψJT Junction-to-top characterization parameter 3.9 °C/W
ψJB Junction-to-board characterization parameter 36.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 13.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

Conditions are –40°C ≤ (TJ = TA) ≤ 125°C, 4.5 V ≤ VIN ≤ 5.5 V, VEN = VIN and RILIM_SET = 22.1 kΩ. Positive current are into pins. Typical values are at 25°C. All voltages are with respect to GND (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SWITCH
RDS(on) Static drain-source ON-state resistance IOUT = 2 A 70 120 mΩ
IOUT = 2 A, –40ºC ≤ (TJ =TA) ≤ 85ºC 70 105
IOUT = 2 A, TJ =TA = 25ºC 70 84
IREV Reverse leakage current VOUT = 5.5 V, VIN = VEN = 0 V 0.01 2 µA
DISCHARGE
RDCHG Discharge resistance VOUT = 4 V 400 500 630 Ω
CURRENT LIMIT
IOS OUT short-circuit current limit RILIM_SET = 44.2 kΩ 1060 1160 1270 mA
RILIM_SET = 22.1 kΩ 2110 2300 2550
RILIM_SET = 16.9 kΩ 2760 3025 3330
HICCUP MODE
VOUT_SHORT OUT voltage threshold of going into hiccup mode VIN = 5 V, RILIIM_SET = 210 kΩ 3.6 3.8 4.1 V
UNDERVOLTAGE LOCKOUT
VUVLO IN UVLO threshold voltage, rising 3.9 4.1 4.3 V
Hysteresis(1) 100 mV
SUPPLY CURRENT
IIN_OFF Disabled, IN supply current VEN = 0 V, VIN = 5.5 V,
–40ºC ≤ TJ ≤ 85ºC		 0.1 2 µA
IIN_ON Enabled, IN supply current VEN = VIN, RILIM_SET = 210 kΩ 180 230
THERMAL SHUTDOWN
Temperature rising threshold(1) Not in current limit 155 ºC
In current limit 135
Hysteresis (1) 10
OUT CURRENT DETECTION
IHCC_TH Load detection current threshold, rising (1) RILIM_SET = 22.1 kΩ 1060 mA
RILIM_SET = 44.2 kΩ 560
IHCC_TH_HYS Load detection current Hysteresis(1) RILIM_SET = 22.1 kΩ 230 mA
RILIM_SET = 44.2 kΩ 120
VCS CS output active-low voltage(1) ICS = 1 mA 0 80 140 mV
ENABLE INPUT (EN)
VEN_TRIP EN threshold voltage, falling 0.9 1.1 1.65 V
VEN_TRIP_HYS Hysteresis 100 200 300 mV
IEN Leakage current VEN = 0 V or VEN = 5.5 V –0.5 0.5 µA
BC 1.2 DCP MODE (SHORT MODE)
RDPM_SHORT DP and DM shorting resistance VDP = 0.8 V, IDM = 1 mA 125 200 Ω
RDCHG_SHORT Resistance between DP/DM and GND VDP = 0.8 V 400 700 1300 kΩ
VDPL_TH_DETACH Voltage threshold on DP under which the device goes back to divider mode 310 330 350 mV
VDPL_TH_DETACH_HYS Hysteresis 50 (1) mV
DIVIDER MODE
VDP_2.7V DP output voltage VIN = 5 V 2.57 2.7 2.84 V
VDM_2.0V DM output voltage VIN = 5 V 1.9 2 2.1
RDP_PAD1 DP output impedance IDP = –5 µA 24 30 40 kΩ
RDM_PAD1 DM output impedance IDM = –5 µA 24 30 40
1.2 V / 1.2 V MODE
VDP_1.2V DP output voltage VIN = 5 V 1.12 1.2 1.28 V
VDM_1.2V DM output voltage VIN = 5 V 1.12 1.2 1.28 V
RDP_PAD2 DP output impedance IDP = –5 uA 80 105 130 kΩ
RDM_PAD2 DM output impedance IDM = –5 uA 80 105 130 kΩ
(1) Specified by design. Not production tested.

6.6 Switching Characteristics

Conditions are –40°C ≤ (TJ = TA) ≤ 125°C, 4.5 V ≤ VIN ≤ 5.5 V, VEN = VIN and RILIM_SET = 22.1 kΩ. Positive current are into pins. Typical values are at 25°C. All voltages are with respect to GND (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER SWITCH
tr OUT voltage rise time CL = 1 µF, RL = 100 Ω, VIN = 5 V see Figure 1, Figure 3 1 1.5 ms
tf OUT voltage fall time CL = 1 µF, RL = 100 Ω, VIN = 5 V see Figure 1, Figure 3 0.2 0.35 0.5
CURRENT LIMIT
tIOS Short circuit response time(1) VIN = 5 V, RL = 50 mΩ, 2 inches lead length, See Figure 4 1.5 µs
HICCUP MODE
tOS_DEG ON-time of hiccup mode(1) VIN = 5 V, RL = 0 16 ms
tSC_TURN_OFF OFF-time of hiccup mode(1) VIN = 5 V, RL = 0 12 s
OUT CURRENT DETECTION
tCS_EN CS deglitch time during turning on(1) ICS = 1 mA 8 ms
ENABLE INPUT (EN)
ton OUT voltage turnon time CL = 1 µF, RL = 100 Ω,
see Figure 1, Figure 2 		2.6 5 ms
toff OUT voltage turnoff time 1.7 3
(1) Specified by design. Not production tested.
TPS2511 rise_fall_tst_lusb18.gif Figure 1. Output Rise and Fall Test Load
TPS2511 ena_tim_lusb18.gif Figure 2. Enable Timing, Active High Enable
TPS2511 pwr_on_off_lusb18.gif Figure 3. Power On and Power Off
TPS2511 short_cir_lusb18.gif Figure 4. Output Short-Circuit Parameters

6.7 Typical Characteristics

TPS2511 vo_tj_lusb18.gif
Figure 5. DP and DM Output Voltage vs Temperature
TPS2511 ena_cur_tj_lusb18.gif
Figure 7. Supply Current Enabled vs Temperature
TPS2511 pwr_on_tj_lusb18.gif
Figure 9. Power Switch ON-Resistance (RDS(ON)) vs Temperature
TPS2511 dis_cur_tj_lusb18.gif
Figure 6. Supply Current Disabled vs Temperature
TPS2511 icc_tj_lusb18.gif
Figure 8. Current Limit vs Temperature
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |