ZHCSDG1 March   2015 TPS25200-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 简化电路原理图
  5. 5 修订历史记录
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Enable
      2. 9.3.2 Thermal Sense
      3. 9.3.3 Overcurrent Protection
      4. 9.3.4 FAULT Response
      5. 9.3.5 Output Discharge
    4. 9.4 Device Functional Modes
      1. 9.4.1 Undervoltage Lockout (UVLO)
      2. 9.4.2 Overcurrent Protection (OCP)
      3. 9.4.3 Overvoltage Clamp (OVC)
      4. 9.4.4 Overvoltage Lockout (OVLO)
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Overvoltage and Overcurrent Protector
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Step by Step Design Produce
          2. 10.2.1.2.2 Input and Output Capacitance
          3. 10.2.1.2.3 Programming the Current-Limit Threshold
          4. 10.2.1.2.4 Design Above a Minimum Current Limit
          5. 10.2.1.2.5 Design Below a Maximum Current Limit
          6. 10.2.1.2.6 Power Dissipation and Junction Temperature
        3. 10.2.1.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13器件和文档支持
    1. 13.1 文档支持
      1. 13.1.1 相关文档　
    2. 13.2 商标
    3. 13.3 静电放电警告
    4. 13.4 术语表
  14. 14机械封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

DRV Package
6-Pin WSON With Exposed Thermal Pad
Top View
TPS25200-Q1 po_6_drv_slvscu5.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
EN 4 I Logic-level control input. When this pin is driven high, the power switch is enabled. When this pin is driven low, the power switch turns off. This pin cannot be left floating and it must be limited below the absolute maximum rating if tied to the IN pin.
FAULT 3 O Active-low open-drain output. This pin is asserted during an overcurrent, overvoltage, or overtemperature event. Connect a pullup resistor to the logic I/O voltage.
GND 5 — Ground connection. Connect this pin externally to the exposed thermal pad.
ILIM 2 O External resistor. The ILIM pin is used to set the current-limit threshold. The recommended value for this pin is: 36 kΩ ≤ RILIM ≤ 1100 kΩ.
IN 6 I Input voltage. Connect a ceramic capacitor with a value of 0.1 μF or greater from the IN pin to the GND pin as close to the IC as possible.
OUT 1 O Protected power switch, VOUT.
Thermal pad — The exposed thermal pad is internally connected to the GND pin. Use the thermal pad to heat-sink the device to the circuit board traces. Connect the thermal pad to the GND pin externally.
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