ZHCSC71E March   2014  – June 2021 TPS25200

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Enable
      2. 8.3.2 Thermal Sense
      3. 8.3.3 Overcurrent Protection
      4. 8.3.4 FAULT Response
      5. 8.3.5 Output Discharge
    4. 8.4 Device Functional Modes
      1. 8.4.1 Undervoltage Lockout (UVLO)
      2. 8.4.2 Overcurrent Protection (OCP)
      3. 8.4.3 Overvoltage Clamp (OVC)
      4. 8.4.4 Overvoltage Lockout (OVLO)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Step by Step Design Produce
        2. 9.2.2.2 Input and Output Capacitance
        3. 9.2.2.3 Programming the Current-Limit Threshold
        4. 9.2.2.4 Design Above a Minimum Current Limit
        5. 9.2.2.5 Design Below a Maximum Current Limit
        6. 9.2.2.6 Power Dissipation and Junction Temperature
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)TPS25200UNIT
DRV (WSON)
6 PINS
θJAJunction-to-ambient thermal resistance66.5°C/W
θJCtopJunction-to-case (top) thermal resistance83.4°C/W
θJBJunction-to-board thermal resistance36.1°C/W
ψJTJunction-to-top characterization parameter1.6°C/W
ψJBJunction-to-board characterization parameter36.5°C/W
θJCbotJunction-to-case (bottom) thermal resistance7.6°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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