TI recommends placing the 100-nF bypass capacitor near the IN and GND pins, and make the connections using a low-inductance trace.
TI recommends placing a high-value electrolytic capacitor and a 100-nF bypass capacitor on the output pin when large transient currents are expected on the output.
The traces routing the RILIM resistor to the device must be as short as possible to reduce parasitic effects on the current limit accuracy.
The thermal pad must be directly connected to PCB ground plane using wide and short copper trace.