ZHCSFL0 September 2016 TPS2549
PRODUCTION DATA.
| PIN | TYPE(1) | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| CS | 4 | O | Provide sink current proportional to output current. For cable compensation, connect to the feedback divider of the up-stream voltage regulator. |
| CTL1 | 6 | I | Logic-level control inputs for controlling the charging mode and the signal switches; (see Table 2). These pins tie directly to IN or GND without a pullup or pulldown resistor. |
| CTL2 | 7 | I | |
| CTL3 | 8 | I | |
| DM_IN | 11 | I/O | D– data line to downstream connector |
| DM_OUT | 2 | I/O | D– data line to upstream USB host controller |
| DP_IN | 10 | I/O | D+ data line to downstream connector |
| DP_OUT | 3 | I/O | D+ data line to upstream USB host controller |
| EN | 5 | I | Logic-level control input for turning the power switch and the signal switches on/off. When EN is low, the device is disabled, the signal and power switches are OFF. |
| FAULT | 13 | O | Active-low open-drain output, asserted during overtemperature, overcurrent, and DP_IN and DM_IN overvoltage conditions. See Table 1. |
| GND | 14 | — | Ground connection; should be connected externally to the thermal pad. |
| ILIM_HI | 16 | I | Connect external resistor to ground to set the high current-limit threshold. |
| ILIM_LO | 15 | I | Connect external resistor to ground to set the low current-limit threshold and the load-detection current threshold. |
| IN | 1 | PWR | Input supply voltage; connect a 0.1 µF or greater ceramic capacitor from IN to GND as close to the IC as possible. |
| OUT | 12 | PWR | Power-switch output |
| STATUS | 9 | O | Active-low open-drain output, asserted when the load exceeds the load-detection threshold |
| Thermal pad | — | — | Thermal pad on bottom of package. The thermal pad is internally connected to GND and is used to heat-sink the device to the circuit board. Connect the thermal pad to the GND plane. |