For all applications, TI recommends a 0.1-µF or greater ceramic bypass capacitor between IN and GND as close to the device as possible for local noise decoupling. This precaution reduces ringing on the input due to power-supply transients. The application may require additional input capacitance on the input to prevent voltage overshoot from exceeding the absolute-maximum voltage of the device during heavy transient conditions.
Output capacitance is not required, but TI recommends placing a high-value electrolytic capacitor on the output pin when there is an expectation of large transient currents on the output.
The traces routing the RILIM resistor to the device should be as short as possible to reduce parasitic effects on the current limit accuracy.
Connect the thermal pad directly to PCB ground plane using wide and short copper trace.