ZHCSGV1C June 2017 – March 2018 TPS25740B
PRODUCTION DATA.
Care should be taken to control the slew rate of Q1 using C(SLEW); particularly in applications where COUT >> C(SLEW). The slew rate observed on VBUS when charging a purely capacitive load is the same as the slew rate of V(GDNG) and is dominated by the ratio I(GDNON) / C(SLEW). R(SLEW) helps block C(SLEW) from the GDNG pin enabling a faster transient response to OCP.
There may be fault conditions where the voltage on VBUS triggers an OVP condition and then remains at a high voltage even after the TPS25740B configures the voltage source to output 5 V via the CTL pins. When this OVP occurs, the TPS25740B opens Q1 within tFOVP + tFOVPDG. The TPS25740B then issues a hard reset, discharge the power-path via the R(DSCG), and waits for 795 ms before enabling Q1 again. Due to the fault condition the voltage again triggers an OVP event when the voltage on VBUS exceeds V(FOVP). This retry process would continue as long as the fault condition persists, periodically pulsing up to V(FOVP) + VSrcSlewPos x (tFOVP + tFOVPDG) onto the VBUS of the Type-C receptacle. It is recommended to use a slew rate less than the maximum of VSrcSlewPos (30 mV / µs) allowed by USB (refer to 文档支持), the slew rate should instead be set in order to meet the requirement to have the voltage reach the target voltage within tSrcSettle (275 ms). This also limits the out-rush current from the COUT capacitor into the C(PDIN) capacitor and help protect Q1 and RS.