ZHCSP87A December 2022 – September 2023 TPS25772-Q1
PRODUCTION DATA
- 1
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 Device Comparison Table
- 6 Pin Configuration and Functions
-
7 Specifications
- 7.1 Absolute Maximum Ratings
- 7.2 ESD Ratings
- 7.3 Recommended Operating Conditions
- 7.4 Recommended Components
- 7.5 Thermal Information
- 7.6 Buck-Boost Regulator
- 7.7 CC Cable Detection Parameters
- 7.8 CC VCONN Parameters
- 7.9 CC PHY Parameters
- 7.10 Thermal Shutdown Characteristics
- 7.11 Oscillator Characteristics
- 7.12 ADC Characteristics
- 7.13 TVS Parameters
- 7.14 Input/Output (I/O) Characteristics
- 7.15 BC1.2 Characteristics
- 7.16 I2C Requirements and Characteristics
- 7.17 Typical Characteristics
- 8 Parameter Measurement Information
-
9 Detailed Description
- 9.1 Overview
- 9.2 Functional Block Diagram
- 9.3
Feature Description
- 9.3.1 Device Power Management and Supervisory Circuitry
- 9.3.2 TVSP Device Configuration and ESD Protection
- 9.3.3
Buck-Boost Regulator
- 9.3.3.1 Buck-Boost Regulator Operation
- 9.3.3.2 Switching Frequency, Frequency Dither, Phase-Shift and Synchronization
- 9.3.3.3 VIN Supply and VIN Over-Voltage Protection
- 9.3.3.4 Feedback Paths and Error Amplifiers
- 9.3.3.5 Transconductors and Compensation
- 9.3.3.6 Output Voltage DAC, Soft-Start and Cable Droop Compensation
- 9.3.3.7 VBUS Overvoltage Protection
- 9.3.3.8 VBUS Undervoltage Protection
- 9.3.3.9 Current Sense Resistor (RSNS) and Current Limit Operation
- 9.3.3.10 Buck-Boost Peak Current Limits
- 9.3.4 USB-PD Physical Layer
- 9.3.5 VCONN
- 9.3.6 Cable Plug and Orientation Detection
- 9.3.7 ADC
- 9.3.8 BC 1.2, Legacy and Fast Charging Modes (Px_DP, Px_DM)
- 9.3.9 USB2.0 Low-Speed Endpoint
- 9.3.10 Digital Interfaces
- 9.3.11 I2C Interface
- 9.3.12 Digital Core
- 9.3.13 NTC Input
- 9.3.14 Thermal Sensors and Thermal Shutdown
- 9.4 Device Functional Modes
- 10Application and Implementation
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
10.2 Typical Application
Figure 10-3 Shows a typical example of a 65 W output automotive USB Type-C Power Delivery port. The device is internally compensated and optimized for components shown in Table 10-1.
Figure 10-3 TPS25772-Q1 Application Schematic| fSW | CIN + CHF | L | MIN of COUT + CBUS | COUT + CHF | CBUS |
|---|---|---|---|---|---|
| 300 | 22 µF + 2 × 0.1 µF | 4.7 µH | 160 µF | 30 µF + 2 × 0.1 µF | 130 µF + 2 × 0.1 µF |
| 400 | 22 µF + 2 ×0.1 µF | 4.7 µH | 120 µF | 30 µF + 2 × 0.1 µF | 90 µF + 2 × 0.1 µF |
| 400 | 22 µF + 2 × 0.1 µF | 3.3 µH | 140 µF | 30 µF + 2 × 0.1 µF | 110 µF + 2 × 0.1 µF |
| 450 | 22 µF + 2 × 0.1 µF | 3.3 µH | 140 µF | 30 µF + 2 × 0.1 µF | 110 µF + 2 × 0.1 µF |
- 50 V rated capacitors recommended.
Figure 10-4 Input and Output CHF Capacitor PlacementTo ensure adequate decoupling of VIN and VOUT and robust device operation, use two 0.1 μF, CHF capacitors per node, placed on opposite sides of the IC package, as close to the pins as possible. Typically, the inductor is placed on the same PCB layer (top or bottom) as the IC package. The CHF capacitors on the inductor end of the IC package may be placed on the opposite side of the PCB (bottom or top) using vias to minimize trace length from the inductor side IN and OUT pins to the physical location of these capacitors.
| SW1 (1) | SW2 (2) | CSP & CSN Filter (3) | ||||
|---|---|---|---|---|---|---|
| RSNB (0.25 W) | CSNB (50 V) | RSNB (0.25 W) | CSNB (50 V) | RCSP (0.1 W) | RCSN (0.1 W) | CFLT (50 V) |
| 2.2 Ω || 2.2 Ω | 1 nf | 2.2 Ω || 2.2 Ω | 3.3 nF | 10 Ω | 0 Ω | 0.22 μF |
- As needed for EMI mitigation - user optional. (Use of this snubber can also aid in supporting devices with high initial inrush load current that exceeds the power delivery specification.)
- Required for robust device operation.
- Required to meet USB-IF current regulation requirements.