ZHCSP87A December   2022  – September 2023 TPS25772-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison Table
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Recommended Components
    5. 7.5  Thermal Information
    6. 7.6  Buck-Boost Regulator
    7. 7.7  CC Cable Detection Parameters
    8. 7.8  CC VCONN Parameters
    9. 7.9  CC PHY Parameters
    10. 7.10 Thermal Shutdown Characteristics
    11. 7.11 Oscillator Characteristics
    12. 7.12 ADC Characteristics
    13. 7.13 TVS Parameters
    14. 7.14 Input/Output (I/O) Characteristics
    15. 7.15 BC1.2 Characteristics
    16. 7.16 I2C Requirements and Characteristics
    17. 7.17 Typical Characteristics
  9. 8 Parameter Measurement Information
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Device Power Management and Supervisory Circuitry
        1. 9.3.1.1 VIN UVLO and Enable/UVLO
        2. 9.3.1.2 Internal LDO Regulators
      2. 9.3.2  TVSP Device Configuration and ESD Protection
      3. 9.3.3  Buck-Boost Regulator
        1. 9.3.3.1  Buck-Boost Regulator Operation
        2. 9.3.3.2  Switching Frequency, Frequency Dither, Phase-Shift and Synchronization
        3. 9.3.3.3  VIN Supply and VIN Over-Voltage Protection
        4. 9.3.3.4  Feedback Paths and Error Amplifiers
        5. 9.3.3.5  Transconductors and Compensation
        6. 9.3.3.6  Output Voltage DAC, Soft-Start and Cable Droop Compensation
        7. 9.3.3.7  VBUS Overvoltage Protection
        8. 9.3.3.8  VBUS Undervoltage Protection
        9. 9.3.3.9  Current Sense Resistor (RSNS) and Current Limit Operation
        10. 9.3.3.10 Buck-Boost Peak Current Limits
      4. 9.3.4  USB-PD Physical Layer
        1. 9.3.4.1 USB-PD Encoding and Signaling
        2. 9.3.4.2 USB-PD Bi-Phase Marked Coding
        3. 9.3.4.3 USB-PD Transmit (TX) and Receive (Rx) Masks
        4. 9.3.4.4 USB-PD BMC Transmitter
        5. 9.3.4.5 USB-PD BMC Receiver
        6. 9.3.4.6 Squelch Receiver
      5. 9.3.5  VCONN
      6. 9.3.6  Cable Plug and Orientation Detection
        1. 9.3.6.1 Configured as a Source
        2. 9.3.6.2 Configured as a Sink
        3. 9.3.6.3 Overvoltage Protection (Px_CC1, Px_CC2)
      7. 9.3.7  ADC
        1. 9.3.7.1 ADC Divider Ratios
      8. 9.3.8  BC 1.2, Legacy and Fast Charging Modes (Px_DP, Px_DM)
      9. 9.3.9  USB2.0 Low-Speed Endpoint
      10. 9.3.10 Digital Interfaces
        1. 9.3.10.1 General GPIO
        2. 9.3.10.2 I2C Buffer
      11. 9.3.11 I2C Interface
        1. 9.3.11.1 I2C Interface Description
        2. 9.3.11.2 I2C Clock Stretching
        3. 9.3.11.3 I2C Address Setting
        4. 9.3.11.4 Unique Address Interface
        5. 9.3.11.5 I2C Pullup Resistor Calculation
      12. 9.3.12 Digital Core
        1. 9.3.12.1 Device Memory
        2. 9.3.12.2 Core Microprocessor
      13. 9.3.13 NTC Input
      14. 9.3.14 Thermal Sensors and Thermal Shutdown
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Application GUI Selections
        2. 10.2.2.2 EEPROM Selection
        3. 10.2.2.3 EN/UVLO
        4. 10.2.2.4 Sense Resistor, RSNS, RCSP, RCSN and CFILT
        5. 10.2.2.5 Inductor Currents
        6. 10.2.2.6 Output Capacitor
        7. 10.2.2.7 Input Capacitor
      3. 10.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 接收文档更新通知
    3. 11.3 支持资源
    4. 11.4 Trademarks
    5. 11.5 静电放电警告
    6. 11.6 术语表
  13. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Recommended Components

over operating free-air temperature range (unless otherwise noted)
PARAMETER (1) VOLTAGE RATING MIN TYP MAX UNIT
CIN Capacitance on VIN 40 V 22 47 µF
CLDO_5V Capacitance on LDO_5V (supplied internally) 10 V 4.7 10 µF
CLDO_5V Capacitance on LDO_5V (supplied externally) 10 V 10 47 100 µF
CLDO_3V3 Capacitance on LDO_3V3 6.3 V 4.7 10 µF
CLDO_1V5 Capacitance on LDO_1V5 6.3 V 4.7 10 µF
CPx_CCy Capacitance on Px_CCy pins(2) 6.3 V 200 330 480 pF
CBOOT1, CBOOT2 Boot charge capacitance 10 V 0.08 0.1 0.3 µF
RSnubber_SW1 RC snubber resistor on SW1 35 V, 0.25 W 1.1 Ω
CSnubber_SW1 RC snubber capacitor on SW1 35 V 1 nF
RSnubber_SW2 RC snubber resistor on SW2 35 V, 0.25 W 1.1 Ω
CSnubber_SW2 RC snubber capacitor on SW2 35 V 3.3 nF
COUT Capacitance on OUT (4) 35 V 30 33 40 µF
CBUS Capacitance on PA_VBUS 35 V 100 120 150 µF
L Inductor (4) 3.3 4.7 5.6 µH
NTC Thermistor 47 100 kΩ
REN/UVLO Enable/UVLO pull up resistance 47 kΩ
TVPS pin components (CTVSP || (DamperR + C)) CTVSP Capacitance on TVSP pin href  40 V 0.08 0.1 0.12 µF
TVPS pin components (CTVSP || (DamperR + C)) Damper resistor R of R + C network in Parallel with CTVSP 0.25W 8 10 12 Ω
TVPS pin components (CTVSP || (DamperR + C)) Damper capacitor C of R + C network in Parallel with CTVSP 40 V 0.376 0.47 0.564 µF
ESRCTVSP TVSP Capacitor ESR (eq series resistance) 10 mΩ
ESLCTVSP TVSP Capacitor ESL (eq series inductance) 1 nH
(1) Capacitance values do not include any derating factors. For example, if 5.0 µF is required and the external capacitor value reduces by 50% at the required operating voltage, then the required external capacitor value would be 10 µF.
(2) This includes all capacitance to the Type-C receptacle.
(3) Maximum capacitance allowed on TVSP pin to ensure proper decode of device configuration during boot.
(4) See applications section for recommended L and COUT combinations.
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