ZHCSCK2
June 2014
PRODUCTION DATA.
1
特性
2
应用范围
3
说明
4
简化电路原理图
5
修订历史记录
6
Pin Configuration and Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
Handling Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Characteristics
7.5
Electrical Characteristics
7.6
Timing Requirements
7.7
Typical Characteristics
8
Parametric Measurement Information
9
Detailed Description
9.1
Overview
9.2
Functional Block Diagram
9.3
Feature Description
9.3.1
Enable and Adjusting Undervoltage Lockout
9.3.2
Overvoltage Protection (OVP)
9.3.3
Hot Plug-in and In-Rush Current Control
9.3.4
Overload and Short Circuit Protection :
9.3.4.1
Overload Protection
9.3.4.2
Short Circuit Protection
9.3.4.3
Start-Up with Short on Output
9.3.4.4
Constant Current Limit Behavior During Overcurrent Faults
9.3.5
FAULT Response
9.3.6
Current Monitoring:
9.3.7
Power Good Comparator
9.3.8
IN, OUT and GND Pins
9.3.9
Thermal Shutdown:
9.4
Device Functional Modes
9.4.1
DevSleep Mode for SATA® Interface Devices
9.4.2
Shutdown Control
10
Application and Implementation
10.1
Application Information
10.2
Typical Application
10.2.1
eFuse for Enterprise SSDs
10.2.1.1
Design Requirements
10.2.1.2
Detailed Design Procedure
10.2.1.2.1
Step by Step Design Procedure
10.2.1.2.2
Programming the Current-Limit Threshold: R(ILIM) Selection
10.2.1.2.3
Undervoltage Lockout and Overvoltage Set Point
10.2.1.2.4
Programming Current Monitoring Resistor - RIMON
10.2.1.2.5
Setting Output Voltage Ramp time (tdVdT)
10.2.1.2.5.1
Case1: Start-up Without Load: Only Output Capacitance C(OUT) Draws Current During Start-up
10.2.1.2.5.2
Case 2: Start-up With Load: Output Capacitance C(OUT) and Load Draws Current During Start-up
10.2.1.2.6
Programing the Power Good Set Point
10.2.1.2.7
Support Component Selections - R6, R7 and CIN
10.2.1.3
Application Curves
10.3
System Examples
10.3.1
Power Failure Protection and Data Retention in SSDs
10.3.2
Boost Power Rail Configuration for Data Retention in Enterprise SSDs
11
Power Supply Recommendations
11.1
Transient Protection
11.2
Output Short-Circuit Measurements
12
Layout
12.1
Layout Guidelines
12.2
Layout Example
13
器件和文档支持
13.1
相关链接
13.2
Trademarks
13.3
Electrostatic Discharge Caution
13.4
Glossary
14
机械封装和可订购信息
封装选项
请参考 PDF 数据表获取器件具体的封装图。
机械数据 (封装 | 引脚)
RVC|20
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsck2_oa
8 Parametric Measurement Information
Figure 42. Timing Diagrams
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