ZHCSQ76 December   2022 TPS25961

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 典型特性
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 欠压保护 (UVP) 和欠压锁定 (UVLO)
      2. 7.3.2 Overvoltage Protection
      3. 7.3.3 Inrush Current, Overcurrent and Short Circuit Protection
        1. 7.3.3.1 Slew Rate and Inrush Current Control (dVdt)
        2. 7.3.3.2 Active Current Limiting
        3. 7.3.3.3 Short-Circuit Protection
      4. 7.3.4 Overtemperature Protection (OTP)
      5. 7.3.5 Fault Response
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 典型应用
      1. 8.2.1 Adapter input protection for set-top boxes
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Programming the Current-Limit Threshold: RILM Selection
        2. 8.2.3.2 欠压和过压锁定设定点
        3. 8.2.3.3 Output Voltage Rise Time (tR)
      4. 8.2.4 Application Curves
    3. 8.3 Application Example
      1. 8.3.1 Application Curves
    4. 8.4 Power Supply Recommendations
      1. 8.4.1 瞬态保护
      2. 8.4.2 Output Short-Circuit Measurements
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  9. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 商标
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 术语表
  10. 10Mechanical, Packaging, and Orderable Information

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Output Voltage Rise Time (tR)

For a successful design, the junction temperature of device must be kept below the absolute maximum rating during both dynamic (start-up) and steady-state conditions. Dynamic power stresses often are an order of magnitude greater than the static stresses, so it is important to to determine that power dissipation is below a certain limit to avoid thermal shutdown during start-up.

Slew rate is 5 V/ms typically for TPS25961. The inrush current can be calculated as:

Equation 9. IINRUSH mA=SR (V/ms) x COUT µF=5 x 1=5 mA 
The average power dissipation inside the part during inrush can be calculated as:

Equation 10. PDINRUSH W=IINRUSH A x VIN V2=0.005 x 122=0.03 W
For the given power dissipation, the thermal shutdown time of the device must be greater than the ramp-up time tR to avoid start-up failure. Figure 8-2 shows the thermal shutdown limit, for 0.03 W of power, the shutdown time is very large as compared to tR = 2.4 ms. Therefore this application will have successful startup.

Figure 8-2 Time to Thermal Shutdown vs Power Dissipation