ZHCSOF8C november 2021 – april 2023 TPS2597
PRODUCTION DATA
The device monitors the internal die temperature (TJ) at all times and shuts down the part as soon as the temperature exceeds a safe operating level (TSD), thereby protecting the device from damage. The device does not turn back on until the junction cools down sufficiently, that is the die temperature falls below (TSD – TSDHYS).
When the TPS2597xL (latch-off variant) detects thermal overload, it shuts down and remains latched-off until the device is power cycled or re-enabled. When the TPS2597xA (auto-retry variant) detects thermal overload, it remains off until it has cooled down by TSDHYS. Thereafter, the device remains off for an additional delay of tRST after which it automatically retries to turn on if it is still enabled.
| DEVICE | ENTER TSD | EXIT TSD |
|---|---|---|
| TPS2597xL (Latch-Off) | TJ ≥ TSD | TJ < TSD – TSDHYS
VIN cycled to 0 V and then above VUVP(R) OR EN/UVLO toggled below VSD(F) |
| TPS2597xA (Auto-Retry) | TJ ≥ TSD | TJ < TSD –
TSDHYS VIN cycled to 0 V and then above VUVP(R) or EN/UVLO toggled below VSD(F) or tRST timer expired |