ZHCSOF5A May   2022  – September 2022 TPS25985

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Logic Interface
    7. 7.7 Timing Requirements
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Undervoltage Protection
      2. 8.3.2  Insertion Delay
      3. 8.3.3  Overvoltage Protection
      4. 8.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 8.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 8.3.4.1.1 Start-Up Time Out
        2. 8.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 8.3.4.3 Active Current Limiting During Start-Up
        4. 8.3.4.4 Short-Circuit Protection
      5. 8.3.5  Analog Load Current Monitor (IMON)
      6. 8.3.6  Mode Selection (MODE)
      7. 8.3.7  Parallel Device Synchronization (SWEN)
      8. 8.3.8  Stacking Multiple eFuses for Unlimited Scalability
        1. 8.3.8.1 Current Balancing During Start-Up
      9. 8.3.9  Analog Junction Temperature Monitor (TEMP)
      10. 8.3.10 Overtemperature Protection
      11. 8.3.11 Fault Response and Indication (FLT)
      12. 8.3.12 Power Good Indication (PG)
      13. 8.3.13 Output Discharge
      14. 8.3.14 General Purpose Comparator
      15. 8.3.15 FET Health Monitoring
      16. 8.3.16 Single Point Failure Mitigation
        1. 8.3.16.1 IMON Pin Single Point Failure
        2. 8.3.16.2 ILIM Pin Single Point Failure
        3. 8.3.16.3 IREF Pin Single Point Failure
        4. 8.3.16.4 ITIMER Pin Single Point Failure
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Single Device, Standalone Operation
      2. 9.1.2 Multiple Devices, Parallel Connection
    2. 9.2 Typical Application: 12-V, 3.6-kW Power Path Protection in Datacenter Servers
      1. 9.2.1 Application
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
      4. 9.2.4 Application Performance Plots
    3. 9.3 Multiple eFuses, Parallel Connection with PMBus
    4. 9.4 Digital Telemetry Using External Microcontroller
    5. 9.5 What to Do and What Not to Do
  10. 10Power Supply Recommendations
    1. 10.1 Transient Protection
    2. 10.2 Output Short-Circuit Measurements
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 接收文档更新通知
    3. 12.3 支持资源
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9.2.2 Design Requirements

Table 9-1 shows the design parameters for this application example.

Table 9-1 Design Parameters
PARAMETERVALUE
  • Input voltage range (VIN)
  • 10.8 V – 13.2 V
  • Maximum DC load current (IOUT(max))
  • 300 A
  • Maximum output capacitance (CLOAD)
  • 55 mF
Are all the loads off until the PG is asserted?

No

Load at start-up (RLOAD(Startup))

0.33 Ω (equivalent to approximately 12% of the maximum steady-state load)

Maximum ambient temperature

55°C

Transient overload blanking timer

16 ms

Output voltage slew rate

1.2 V/ms

Need to survive a “hot-short” on output condition ?

Yes

Need to survive a “power up into short” condition?

Yes

Can a board be hotplugged in or power cycled?

Yes

Load current monitoring needed?

Yes

Fault response

Latch-off
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