To prevent thermal shutdown, T_J must be less than T_ABS. If the output current is very high, the power dissipation can be large. The VQFN package has good thermal impedance. However, the PCB layout is very important. Good PCB design can optimize heat transfer, which is absolutely essential for the long-term reliability of the device.

1. Maximize the copper coverage on the PCB to increase the thermal conductivity of the board. The major heat-flow path from the package to the ambient is through the copper on the PCB. Maximum copper is extremely important when there are not any heat sinks attached to the PCB on the other side of the board opposite the package.
2. Add as many thermal vias as possible directly under the package ground pad to optimize the thermal conductivity of the board
3. Plate shut or plug and cap all thermal vias on both sides of the board to prevent solder voids. To ensure reliability and performance, the solder coverage must be at least 85%.