7.1 Absolute Maximum Ratings
over operating ambient temperature range (unless otherwise noted) (1)(2)
|
MIN |
MAX |
UNIT |
| Supply voltage |
t < 400 ms |
|
45 |
V |
| Reverse polarity voltage(3) |
–36 |
|
V |
| Current on GND pin |
t < 2 minutes |
–100 |
250 |
mA |
| Voltage on INx, DIAG_EN, SEL, and THER pins |
–0.3 |
7 |
V |
| Current on INx, DIAG_EN, SEL, and THER pins |
–10 |
— |
mA |
| Voltage on STx or FAULT pins |
–0.3 |
7 |
V |
| Current on STx or FAULT pins |
–30 |
10 |
mA |
| Voltage on CS pin |
–2.7 |
7 |
V |
| Current on CS pin |
— |
30 |
mA |
| Voltage on CL pin |
–0.3 |
7 |
V |
| Current on CL pin |
— |
6 |
mA |
| Inductive load switch-off energy dissipation, single pulse, single channel(4) |
— |
40 |
mJ |
| Operating junction temperature, TJ |
–40 |
150 |
°C |
| Storage temperature, Tstg |
–65 |
150 |
°C |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the ground plane.
(3) Reverse polarity condition: t < 60 s, reverse current < IR(2), VINx = 0 V, all channels reverse, GND pin 1-kΩ resistor in parallel with diode.
(4) Test condition: VVS = 13.5 V, L = 300 mH, TJ = 150°C. FR4 2s2p board, 2 × 70-μm Cu, 2 × 35-µm Cu. 600 mm2 thermal pad copper area.