ZHCSL89B may   2020  – november 2020 TPS3703

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
    1.     Pin Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Timing Diagrams
    8. 7.8 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDD
      2. 8.3.2 SENSE
      3. 8.3.3 RESET
      4. 8.3.4 Capacitor Time (CT)
      5. 8.3.5 Manual Reset (MR)
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation (VDD > VDD(MIN))
      2. 8.4.2 Undervoltage Lockout (VPOR < VDD < UVLO)
      3. 8.4.3 Power-On Reset (VDD < VPOR)
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Voltage Threshold Accuracy
      2. 9.1.2 CT Reset Time Delay
        1. 9.1.2.1 Factory-Programmed Reset Delay Timing
        2. 9.1.2.2 Programmable Reset Delay-Timing
      3. 9.1.3 RESET Latch Mode
      4. 9.1.4 Adjustable Voltage Thresholds
      5. 9.1.5 Immunity to SENSE Pin Voltage Transients
        1. 9.1.5.1 Hysteresis
    2. 9.2 Typical Application
      1. 9.2.1 Design 1: Multi-Rail Window Monitoring for Microcontroller Power Rails
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Design 2: RESET Latch Mode
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
  11. 10Power Supply Recommendations
    1. 10.1 Power Supply Guidelines
  12. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Documentation Support
      1. 12.2.1 Evaluation Module
    3. 12.3 接收文档更新通知
    4. 12.4 支持资源
    5. 12.5 Trademarks
    6. 12.6 静电放电警告
    7. 12.7 术语表
  14. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) TPS3703 UNIT
DSE (WSON)
PINS
RθJA Junction-to-ambient thermal resistance 184.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 30.6 °C/W
RθJB Junction-to-board thermal resistance 86.4 °C/W
ΨJT Junction-to-top characterization parameter 13.4 °C/W
ΨJB Junction-to-board characterization parameter 86.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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