ZHCSNK5B March   2021  – November 2023 TPS3704-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Nomenclature
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 VDD
      2. 7.3.2 SENSEx Input
        1. 7.3.2.1 Immunity to SENSEx Pins Voltage Transients
          1. 7.3.2.1.1 SENSEx Hysteresis
      3. 7.3.3 RESETx/RESETx
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation (VDD > VDD(MIN))
      2. 7.4.2 Undervoltage Lockout (VPOR < VDD < UVLO)
      3. 7.4.3 Power-On Reset (VDD < VPOR)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Voltage Threshold Accuracy
      2. 8.1.2 Adjustable Voltage Thresholds
    2. 8.2 Typical Applications
      1. 8.2.1 Design 1: Multi-Rail Window Monitoring for Microcontroller Power Rails
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
      2. 8.2.2 Design 2: Manual Self-Test Option for Enhanced Functional Safety Use Cases
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Guidelines
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 接收文档更新通知
    3. 9.3 支持资源
    4. 9.4 Trademarks
    5. 9.5 静电放电警告
    6. 9.6 术语表
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC (1) TPS3704x-Q1 UNIT
DDF 
PINS
RθJA Junction-to-ambient thermal resistance 121.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.6 °C/W
RθJB Junction-to-board thermal resistance 42.3 °C/W
ΨJT Junction-to-top characterization parameter 2.2 °C/W
ΨJB Junction-to-board characterization parameter 42.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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