SLVS331J December   2000  – August 2024 TPS3813

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Dissipation Ratings
    9. 6.9 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Voltage (VDD)
        1. 7.3.1.1 VDD Hysteresis
        2. 7.3.1.2 VDD Glitch Immunity
      2. 7.3.2 User-Programmable Watchdog Timer (WDI)
      3. 7.3.3 RESET Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation (VDD > VIT)
      2. 7.4.2 Above Power-On Reset But Less Than Threshold (VPOR < VDD < VIT)
      3. 7.4.3 Below Power-On Reset (VDD < VPOR)
    5. 7.5 Programming
      1. 7.5.1 Implementing Window-Watchdog Settings
      2. 7.5.2 Programmable Window-Watchdog by Using an External Capacitor
      3. 7.5.3 Lower Boundary Calculation
      4. 7.5.4 Watchdog Software Considerations
      5. 7.5.5 Power-Up Considerations
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Links
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC (1) TPS3813xxx UNIT
DBV (SOT-23)
6 PINS
RθJA Junction-to-ambient thermal resistance 208.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 123.3 °C/W
RθJB Junction-to-board thermal resistance 37.2 °C/W
ψJT Junction-to-top characterization parameter 14.6 °C/W
ψJB Junction-to-board characterization parameter 36.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |