SLVS292F June   2000  – September 2019 TPS3836 , TPS3837 , TPS3838

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical Application Circuit
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Dissipation Ratings
    3. 7.3 ESD Ratings
    4. 7.4 Recommended Operating Conditions
    5. 7.5 Thermal Information
    6. 7.6 Electrical Characteristics
    7. 7.7 Timing Requirements
    8. 7.8 Switching Characteristics
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
    1. 8.1 Timing Diagram
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Voltage (VDD)
      2. 9.3.2 Manual Reset (MR)
      3. 9.3.3 Selectable Reset Delay (CT)
      4. 9.3.4 Reset Output (RESET / RESET)
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Related Links
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • DBV|5
散热焊盘机械数据 (封装 | 引脚)
订购信息

Revision History

Changes from E Revision (October 2010) to F Revision

  • Changed format to meet latest data sheet standards; changed data sheet title, added Device Information table, Pin Configurations and Functions, Parameter Measurement Information, Detailed Description, Application and Implementation, Power Supply Recommendations, Layout, Receiving Notification of Documentation Updates, and Support Resources sections. Moved existing sections into the new formatGo
  • Changed 2x2 WSON to 2-mm × 2-mm WSON in fifth Features bulletGo
  • Changed link to automotive data sheetGo
  • Added full acronym name for DSP to first sentence of Description section Go
  • Changed 2x2 WSON to 2-mm × 2-mm WSON in last paragraph of Description sectionGo
  • Changed Ordering Information table to Device Comparison TableGo
  • Deleted soldering temperature parameter from Absolute Maximum Ratings table Go
  • Moved storage temperature range to Absolute Maximum Ratings tableGo
  • Changed Handling Ratings table to ESD RatingsGo
  • Added Thermal Information tableGo
  • Moved propagation (delay) time maximum values to the TYP column Go
  • Changed propagation times for the high-to-low-level output and low-to-high-level output from: 0.1 µs to: 0.3 µsGo