ZHCSKS5C September   2020  – January 2024 TPS3899

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Device Comparison
  6.   Pin Configuration and Functions
  7. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  8. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 VDD Hysteresis
      2. 6.3.2 User-Programmable Sense and Reset Time Delay
      3. 6.3.3 RESET/RESET Output
      4. 6.3.4 SENSE Input
        1. 6.3.4.1 Immunity to SENSE Pin Voltage Transients
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation (VDD > VDD(min))
      2. 6.4.2 Above Power-On-Reset But Less Than VDD(min) (VPOR < VDD < VDD(min))
      3. 6.4.3 Below Power-On-Reset (VDD < VPOR)
  9. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
      4. 7.2.4 Power Supply Recommendations
      5. 7.2.5 Layout
        1. 7.2.5.1 Layout Guidelines
        2. 7.2.5.2 Layout Example
  10. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 支持资源
    4. 8.4 Trademarks
    5. 8.5 静电放电警告
    6. 8.6 术语表
  11. 9 Revision History
  12. 10Mechanical, Packaging, and Orderable Information

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7 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
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