SNVSBM4D March   2022  – October 2024 TPS389006-Q1 , TPS389R0-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  I2C
      2. 7.3.2  Auto Mask (AMSK)
      3. 7.3.3  Packet Error Checking (PEC)
      4. 7.3.4  VDD
      5. 7.3.5  MON
      6. 7.3.6  NIRQ
      7. 7.3.7  ADC
      8. 7.3.8  Time Stamp
      9. 7.3.9  NRST
      10. 7.3.10 Register Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Built-In Self Test and Configuration Load
        1. 7.4.1.1 Notes on BIST Execution
      2. 7.4.2 TPS389006/08-Q1,TPS389R0-Q1 Power ON
      3. 7.4.3 General Monitoring
        1. 7.4.3.1 IDLE Monitoring
        2. 7.4.3.2 ACTIVE Monitoring
        3. 7.4.3.3 Sequence Monitoring 1
          1. 7.4.3.3.1 ACT Transitions 0→1
          2. 7.4.3.3.2 SLEEP Transition 1→0
          3. 7.4.3.3.3 SLEEP Transition 0→1
        4. 7.4.3.4 Sequence Monitoring 2
          1. 7.4.3.4.1 ACT Transition 1→0
    5. 7.5 Register Maps
      1. 7.5.1 BANK0 Registers
      2. 7.5.2 BANK1 Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Multichannel Sequencer and Monitor
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power Supply Guidelines
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Device Nomenclature
    2. 9.2 Documentation Support
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.7 Typical Characteristics

At TJ = 25°C, VDD = 3.3V , and RPU = 10kΩ, unless otherwise noted.

TPS389006-Q1 TPS389R0-Q1 Idle Input Current Vs TemperatureFigure 6-1 Idle Input Current Vs Temperature
TPS389006-Q1 TPS389R0-Q1 NIRQ Low Level Output Voltage Vs TemperatureFigure 6-3 NIRQ Low Level Output Voltage Vs Temperature
TPS389006-Q1 TPS389R0-Q1 Low Level Input Voltage Vs Temperature Figure 6-5 Low Level Input Voltage Vs Temperature
TPS389006-Q1 TPS389R0-Q1 Active Input Current Vs TemperatureFigure 6-2 Active Input Current Vs Temperature
TPS389006-Q1 TPS389R0-Q1 High Level Input Voltage Vs TemperatureFigure 6-4 High Level Input Voltage Vs Temperature
TPS389006-Q1 TPS389R0-Q1 Power-on-Reset Voltage Vs TemperatureFigure 6-6 Power-on-Reset Voltage Vs Temperature
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