SLUS659G FEBRUARY   2006  – November 2014 TPS40200

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 MOSFET Gate Drive
      2. 7.3.2 Undervoltage Lockout Protection
      3. 7.3.3 Selecting the Operating Frequency
      4. 7.3.4 Synchronizing the Oscillator
      5. 7.3.5 Current Limit Resistor Selection
      6. 7.3.6 Calculating the Soft-Start Time
      7. 7.3.7 Voltage Setting and Modulator Gain
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation Near Minimum Input Voltage
      2. 7.4.2 Operation With SS Pin
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Buck Regulator, 8 V to 12 V Input, 3.3 V to 5.0 V at 2.5-A Output
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 FET Selection Criteria
          2. 8.2.1.2.2 Rectifier Selection Criteria
          3. 8.2.1.2.3 Inductor Selection Criteria
          4. 8.2.1.2.4 Output Capacitance
          5. 8.2.1.2.5 Switching Frequency
          6. 8.2.1.2.6 Calculating the Overcurrent Threshold Level
          7. 8.2.1.2.7 Soft-Start Capacitor
          8. 8.2.1.2.8 Frequency Compensation
            1. 8.2.1.2.8.1 Step 1
            2. 8.2.1.2.8.2 Step 2
            3. 8.2.1.2.8.3 Step 3
            4. 8.2.1.2.8.4 Step 4
            5. 8.2.1.2.8.5 Step 5
          9. 8.2.1.2.9 Printed Circuit Board Plots
        3. 8.2.1.3 Application Curves
      2. 8.2.2 18 V - 50 V Input, 16 V at 1-A Output
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedures
        3. 8.2.2.3 Application Curves
      3. 8.2.3 Wide Input Voltage Led Constant Current Driver
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedures
        3. 8.2.3.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Related Products
      2. 11.1.2 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • DRB|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Device and Documentation Support

11.1 Device Support

11.1.1 Related Products

DEVICE NUMBER DESCRIPTION
TPS4007 Low Input Synchronous Buck Controller
TPS4009
TL5001 Wide Input Range Controller
TPS40057 Wide input (8V to 40V) Synchronous Buck Controller
TPS40190 Low Pin Count Synchronous Buck Controller
TPS40192 – 4.5 V to 18 V Low Pin Count Synchronous Buck Controller
TPS40193

11.1.2 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

  • Under the Hood of Low Voltage DC/DC Converters – SEM1500 Topic 5 – 2002 Seminar Series
  • Understanding Buck Power Stages in Switchmode Power Supplies – SLVA057
  • Design and Application Guide for High Speed MOSFET Gate Drive Circuits- SEM 1400 – 2001 Seminar Series
  • Designing Stable Control Loops - SEM 1400 – 2001 Seminar Series
  • http://power.ti.com

11.3 Trademarks

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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