SLUSAF8E July   2011  – January 2016 TPS40322

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Voltage Reference
      2. 7.3.2  Output Voltage Setting
      3. 7.3.3  Input Voltage Feedforward
      4. 7.3.4  Current Sensing
      5. 7.3.5  Overcurrent Protection
      6. 7.3.6  Two-Phase Mode, Remote Sense Amplifier, and Current Sharing Loop
      7. 7.3.7  Start-Up and Shutdown
        1. 7.3.7.1 Start-Up Sequence
        2. 7.3.7.2 Prebiased Output Start-Up
        3. 7.3.7.3 Shutdown
      8. 7.3.8  Switching Frequency and Master or Slave Synchronization
      9. 7.3.9  Overvoltage and Undervoltage Fault Protection
      10. 7.3.10 Input Undervoltage Lockout (UVLO)
      11. 7.3.11 Power Good
      12. 7.3.12 Thermal Shutdown
      13. 7.3.13 Connection of Unused Pins
    4. 7.4 Device Functional Modes
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Dual-Output Configuration from 12-V Nominal to 1.2-V and 1.8-V DC-to-DC Converter Using the TPS40322
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Selecting a Switching Frequency
          2. 8.2.1.2.2  Inductor Selection (L1)
          3. 8.2.1.2.3  Output Capacitor Selection (C10 through C16)
          4. 8.2.1.2.4  Peak Current Rating of Inductor
          5. 8.2.1.2.5  Input Capacitor Selection (C3 through C6)
          6. 8.2.1.2.6  MOSFET Selection (Q1)
          7. 8.2.1.2.7  ILIM Resistor (R2)
          8. 8.2.1.2.8  Feedback Divider (R10, R14)
          9. 8.2.1.2.9  Compensation: (R11, R12, C17, C19, C21)
          10. 8.2.1.2.10 Boot-Strap Capacitor (C7)
          11. 8.2.1.2.11 General Device Components
            1. 8.2.1.2.11.1 Synchronization (SYNC Pin)
            2. 8.2.1.2.11.2 RT Resistor (R6)
            3. 8.2.1.2.11.3 Differential Amplifier Out (DIFFO Pin)
            4. 8.2.1.2.11.4 EN/SS Timing Capacitors (C8)
            5. 8.2.1.2.11.5 Power Good (PG1, PG2 Pins)
            6. 8.2.1.2.11.6 Phase Set (PHSET Pin)
            7. 8.2.1.2.11.7 UVLO Programming Resistors (R1 and R3)
            8. 8.2.1.2.11.8 VDD Bypass Capacitor (C2)
            9. 8.2.1.2.11.9 VBP6 Bypass Capacitor (C18)
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Two-Phase, Single Output Configuration from 12-V nominal to 1.2-V DC-to-DC Converter Using the TPS40322
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Stage
      2. 10.1.2 Device Peripheral
      3. 10.1.3 Thermal Pad Layout
    2. 10.2 Layout Example
    3. 10.3 Mounting and Thermal Profile Recommendation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.1.2 Development Support

For delopement support, see the following:

TPS40k Loop Stability Tool

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, see the following:

QFN/SON PCB Attachment Application Report, SLUA271

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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