Layout is a critical portion of good power supply design. Below are the PCB layout considerations for TPS4022 device .

• If the analog ground (AGND) and power ground (PGND) are separated on the board, the power stage and related components should be terminated or bypassed to the power ground. Signal components of TPS4022 device should be terminated or bypassed to the analog ground. Connect the thermal pad of the TPS4022 device to power ground plane through sufficient vias. Connect AGND and PGND pins of the TPS4022 device to the thermal pad directly. The connection between AGND pin and thermal pad serves as the only connection between analog ground and power ground.
• If one common ground is used on the board, the TPS4022 device and related components must be placed on a noise quiet area which is isolated from fast switching voltage and current paths.
• Maintain placement of signal components and regulator bypass capacitors local to the TPS4022 device. Place them as close as possible to the pins to which they are connected. These components include the feedback resistors, frequency compensation, the RT resistor, ADDR0 and ADDR1 resistors, as well as bypass capacitors for BP3, BP6, and VDD.
• The VSNSx and GSNSx are remotely connected to the load through low ohm resistors, and they must be routed as a differential pair on noise quiet area. Place a high-frequency bypass capacitor between the VSNSx pin and the GSNSx pin, and place the capacitor close to the TPS4022 device.
• The CSxP pin and CSxN pin must be routed as a differential pair on noise quiet area. The resistor of R-C network should be placed close to inductor. The capacitor between CSxP pin and CSxN pin must be placed as close as possible to the TPS4022 device.
• Place the thermal transistor close to the inductor. A bypass capacitor with a value of 1-nF or larger must be placed close to the transistor. Use a separate ground trace for the transistor.