ZHCS614G October 2011 – September 2022 TPS40422
PRODUCTION DATA
- 1 特性
- 2 应用
- 3 说明
- 4 Revision History
- 5 说明（续）
- 6 Pin Configuration and Functions
- 7 Specifications
-
8 Detailed Description
- 8.1 Overview
- 8.2 Functional Block Diagram
- 8.3
Feature Description
- 8.3.1 PMBus Interface Protocol General Description
- 8.3.2 Voltage Reference
- 8.3.3 Output Voltage
- 8.3.4 Voltage Feed Forward
- 8.3.5 Current Sensing
- 8.3.6 Overcurrent Protection
- 8.3.7 Current Sharing
- 8.3.8 Linear Regulators
- 8.3.9 BP Switch-over
- 8.3.10 Switching Frequency Setting
- 8.3.11 Switching Node and BOOT Voltage
- 8.3.12 Reading the Output Current
- 8.3.13 Soft-Start Time
- 8.3.14 Turn-On/Turn-Off Delay and Sequencing
- 8.3.15 Pre-Biased Output Start-Up
- 8.3.16 Undervoltage Lockout
- 8.3.17 Overvoltage and Undervoltage Fault Protection
- 8.3.18 Power Good
- 8.3.19 Overtemperature Fault Protection
- 8.3.20 Thermal Shutdown
- 8.3.21 Programmable Fault Responses
- 8.3.22 User Data
- 8.3.23 Adjustable Anti-Cross Conduction Delay
- 8.3.24 Connection of Unused Pins
- 8.4 Device Functional Modes
- 8.5 Programming
- 8.6
Register Maps
- 8.6.1
Supported Commands
- 8.6.1.1 PAGE (00h)
- 8.6.1.2 OPERATION (01h)
- 8.6.1.3 ON_OFF_CONFIG (02h)
- 8.6.1.4 CLEAR_FAULTS (03h)
- 8.6.1.5 WRITE_PROTECT (10h)
- 8.6.1.6 STORE_USER_ALL (15h)
- 8.6.1.7 RESTORE_USER_ALL (16h)
- 8.6.1.8 CAPABILITY (19h)
- 8.6.1.9 VOUT_MODE (20h)
- 8.6.1.10 VIN_ON (35h)
- 8.6.1.11 VIN_OFF (36h)
- 8.6.1.12 IOUT_CAL_GAIN (38h)
- 8.6.1.13 IOUT_CAL_OFFSET (39h)
- 8.6.1.14 IOUT_OC_FAULT_LIMIT (46h)
- 8.6.1.15 IOUT_OC_FAULT_RESPONSE (47h)
- 8.6.1.16 IOUT_OC_WARN_LIMIT (4Ah)
- 8.6.1.17 OT_FAULT_LIMIT (4Fh)
- 8.6.1.18 OT_WARN_LIMIT (51h)
- 8.6.1.19 TON_RISE (61h)
- 8.6.1.20 STATUS_BYTE (78h)
- 8.6.1.21 STATUS_WORD (79h)
- 8.6.1.22 STATUS_VOUT (7Ah)
- 8.6.1.23 STATUS_IOUT (7Bh)
- 8.6.1.24 STATUS_TEMPERATURE (7Dh)
- 8.6.1.25 STATUS_CML (7Eh)
- 8.6.1.26 STATUS_MFR_SPECIFIC (80h)
- 8.6.1.27 READ_VOUT (8Bh)
- 8.6.1.28 READ_IOUT (8Ch)
- 8.6.1.29 READ_TEMPERATURE_2 (8Eh)
- 8.6.1.30 PMBUS_REVISION (98h)
- 8.6.1.31 MFR_SPECIFIC_00 (D0h)
- 8.6.1.32 VREF_TRIM (MFR_SPECIFIC_04) (D4h)
- 8.6.1.33 STEP_VREF_MARGIN_HIGH (MFR_SPECIFIC_05) (D5h)
- 8.6.1.34 STEP_VREF_MARGIN_LOW (MFR_SPECIFIC_06) (D6h)
- 8.6.1.35 PCT_VOUT_FAULT_PG_LIMIT (MFR_SPECIFIC_07) (D7h)
- 8.6.1.36 126
- 8.6.1.37 SEQUENCE_TON_TOFF_DELAY (MFR_SPECIFIC_08) (D8h)
- 8.6.1.38 128
- 8.6.1.39 OPTIONS (MFR_SPECIFIC_21) (E5h)
- 8.6.1.40 DEVICE_CODE (MFR_SPECIFIC_44) (FCh)
- 8.6.1
Supported Commands
-
9 Application and Implementation
- 9.1 Application Information
- 9.2
Typical Application
- 9.2.1
Dual-Output Converter
- 9.2.1.1 Design Requirements
- 9.2.1.2
Detailed Design Procedure
- 9.2.1.2.1 Custom Design with WEBENCH® Tools
- 9.2.1.2.2 Step 1: Inductor Selection
- 9.2.1.2.3 Step 2: Output Capacitor Selection
- 9.2.1.2.4 Step 3: Input Capacitance Selection
- 9.2.1.2.5 Step 4: MOSFET Selection
- 9.2.1.2.6 Step 5: Snubber Circuit Design
- 9.2.1.2.7 Step 6: Soft-Start Time
- 9.2.1.2.8
Step 7: Peripheral Component Design
- 9.2.1.2.8.1 RT (Pin 1) Switching Frequency Setting
- 9.2.1.2.8.2 FB1 (Pin 2) and FB2 (Pin 8) Output Voltage Setting
- 9.2.1.2.8.3 Compensation Network Using COMP1 (Pin 3) , COMP2 (Pin 7), FB1 (Pin 2) FB2 DIFFO1 (Pin 8) (Pin 39)
- 9.2.1.2.8.4 Remote Sensing Using VSNS1 (Pin 37), GSNS1 (Pin 38) , VSNS2 (Pin 15), and GSNS2 (Pin 14)
- 9.2.1.2.8.5 Temperate Sensing Using TSNS1 (Pin36) and TSNS2 (Pin 16)
- 9.2.1.2.8.6 Current Sensing Network Design Using CS1P (Pin 34), CS1N (Pin 35) , CS2P (Pin 18), and CS2N (Pin 17)
- 9.2.1.2.8.7 PMBus Address ADDR1 (Pin 9) , and ADDR0 (Pin 10)
- 9.2.1.2.8.8
Voltage Decoupling Capacitors
- 9.2.1.2.8.8.1 VDD (Pin 31)
- 9.2.1.2.8.8.2 BP3 (Pin 32)
- 9.2.1.2.8.8.3 BNEXT (Pin 24)
- 9.2.1.2.8.8.4 BP6 (Pin 25)
- 9.2.1.2.8.8.5 Power Good PGOOD1 (Pin 33), PGOOD2 (Pin 19)
- 9.2.1.2.8.8.6 Bootstrap Capacitors BOOT1 (Pin 30), and BOOT2 (Pin 20)
- 9.2.1.2.8.8.7 High-Side MOSFET (Gate) Resistor
- 9.2.1.2.8.8.8 Synchronization Setting SYNC (Pin 40)
- 9.2.1.2.8.8.9 BP6 (Pin 25)
- 9.2.1.2.8.8.10 DIFFO (Pin 39)
- 9.2.1.3 Application Curves
- 9.2.1
Dual-Output Converter
- 10Power Supply Recommendations
- 11Layout
- 12Device and Documentation Support
- 13Mechanical, Packaging, and Orderable Information
9.2.1.2.4 Step 3: Input Capacitance Selection
The input capacitance is selected to handle the ripple current of the buck stage, when the high-side MOSFET switches on, while maintaining the ripple voltage on the supply line low. The input voltage ripple depends on input capacitance and ESR. The minimum capacitor and the maximum ESR can be estimated using the Equation 25 and Equation 26 because the input ripple is composed of a capacitive portion,VRIPPLE(CIN), and a resistive portion, VRIPPLE(ESR) . In this case, the allowed ripple for the capacitive portion is 0.1 V and for the resistive portion is 0.1 V.
Equation 25. 
Equation 26. 
For this design example, five 22-µF, 25-V ceramic capacitors and two 330-µF, 25-V electrolytic capacitors were selected in parallel for the power stage with sufficient margin. The electrolytic capacitors provide better stability during load transients by supplying enough current to the controller.