ZHCS189E June   2011  – December 2015 TPS43335-Q1 , TPS43336-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用范围
  3. 3 说明
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 DC Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Buck Controllers: Normal Mode PWM Operation
        1. 7.3.1.1 Frequency Selection and External Synchronization
        2. 7.3.1.2 Enable Inputs
        3. 7.3.1.3 Feedback Inputs
        4. 7.3.1.4 Soft-Start Inputs
        5. 7.3.1.5 Current-Mode Operation
        6. 7.3.1.6 Current Sensing and Current Limit With Foldback
        7. 7.3.1.7 Slope Compensation
        8. 7.3.1.8 Power-Good Outputs and Filter Delays
        9. 7.3.1.9 Light-Load PFM Mode
      2. 7.3.2 Boost Controller
      3. 7.3.3 Frequency-Hopping Spread Spectrum (TPS43336-Q1 Only)
      4. 7.3.4 Gate-Driver Supply (VREG, EXTSUP)
      5. 7.3.5 External P-Channel Drive (GC2) and Reverse Battery Protection
      6. 7.3.6 Undervoltage Lockout and Overvoltage Protection
      7. 7.3.7 Thermal Protection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Buck Controllers: Current-Mode Operation
      2. 7.4.2 Buck Controllers: Light-Load PFM Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Automotive Infotainment Supply
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Boost Component Selection
          2. 8.2.1.2.2  Boost Maximum Input Current IIN_MAX
          3. 8.2.1.2.3  Boost Inductor Selection, L
          4. 8.2.1.2.4  Inductor Ripple Current, IRIPPLE
          5. 8.2.1.2.5  Peak Current in Low-Side FET, IPEAK
          6. 8.2.1.2.6  Right Half-Plane Zero RHP Frequency, fRHP
          7. 8.2.1.2.7  Output Capacitor, COUTx
          8. 8.2.1.2.8  Bandwidth of Boost Converter, fC
          9. 8.2.1.2.9  Output Ripple Voltage Due to Load Transients, ∆VOUTx
          10. 8.2.1.2.10 Selection of Components for Type II Compensation
          11. 8.2.1.2.11 Input Capacitor, CIN
          12. 8.2.1.2.12 Output Schottky Diode D1 Selection
          13. 8.2.1.2.13 Low-Side MOSFET (BOT_SW3)
          14. 8.2.1.2.14 BuckA Component Selection
            1. 8.2.1.2.14.1 BuckA Component Selection
            2. 8.2.1.2.14.2 Current-Sense Resistor RSENSE
          15. 8.2.1.2.15 Inductor Selection L
          16. 8.2.1.2.16 Inductor Ripple Current IRIPPLE
          17. 8.2.1.2.17 Output Capacitor COUTA
          18. 8.2.1.2.18 Bandwidth of Buck Converter fC
          19. 8.2.1.2.19 Selection of Components for Type II Compensation
          20. 8.2.1.2.20 Resistor Divider Selection for Setting VOUTA Voltage
          21. 8.2.1.2.21 BuckB Component Selection
          22. 8.2.1.2.22 Resistor Divider Selection for Setting VOUT Voltage
          23. 8.2.1.2.23 BuckX High-Side and Low-Side N-Channel MOSFETs
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Automotive ADAS Supply
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
  9. 9  Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Grounding and PCB Circuit Layout Considerations
        1. 10.1.1.1 Boost converter
        2. 10.1.1.2 Buck Converter
      2. 10.1.2 Other Considerations
    2. 10.2 Layout Example
    3. 10.3 Power Dissipation Derating Profile, 38-Pin HTTSOP PowerPAD Package
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 文档支持
      1. 11.2.1 相关文档　
    3. 11.3 相关链接
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

11 器件和文档支持

11.1 器件支持

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 文档支持

11.2.1 相关文档　

相关文档请参见以下部分：

《TPS4333xEVM》，SLVU457

11.3 相关链接

下面的表格列出了快速访问链接。范围包括技术文档、支持与社区资源、工具和软件，以及样片或购买的快速访问。

Table 7. 相关链接

部件 米6体育平台手机版_好二三四文件夹 样片与购买 技术文档 工具与软件 支持与社区
TPS43335-Q1 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处
TPS43336-Q1 请单击此处 请单击此处 请单击此处 请单击此处 请单击此处

11.4 社区资源

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.5 商标

PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

11.6 静电放电警告

esds-image

这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损伤。

11.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.
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