ZHCSEX6D December   2015  – December 2019 TPS4H160-Q1

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      典型应用电路原理图
      2.      驱动具有可调节电流限制的电容性负载
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Pin Current and Voltage Conventions
      2. 8.3.2 Accurate Current Sense
      3. 8.3.3 Adjustable Current Limit
      4. 8.3.4 Inductive-Load Switching-Off Clamp
      5. 8.3.5 Fault Detection and Reporting
        1. 8.3.5.1 Diagnostic Enable Function
        2. 8.3.5.2 Multiplexing of Current Sense
        3. 8.3.5.3 Fault Table
        4. 8.3.5.4 STx and FAULT Reporting
      6. 8.3.6 Full Diagnostics
        1. 8.3.6.1 Short-to-GND and Overload Detection
        2. 8.3.6.2 Open-Load Detection
          1. 8.3.6.2.1 Channel On
          2. 8.3.6.2.2 Channel Off
        3. 8.3.6.3 Short-to-Battery Detection
        4. 8.3.6.4 Reverse Polarity Detection
        5. 8.3.6.5 Thermal Fault Detection
          1. 8.3.6.5.1 Thermal Shutdown
      7. 8.3.7 Full Protections
        1. 8.3.7.1 UVLO Protection
        2. 8.3.7.2 Loss-of-GND Protection
        3. 8.3.7.3 Protection for Loss of Power Supply
        4. 8.3.7.4 Reverse-Current Protection
        5. 8.3.7.5 MCU I/O Protection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Working Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
      1. 11.2.1 Without a GND Network
      2. 11.2.2 With a GND Network
  12. 12器件和文档支持
    1. 12.1 接收文档更新通知
    2. 12.2 社区资源
    3. 12.3 商标
    4. 12.4 静电放电警告
    5. 12.5 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6 Pin Configuration and Functions

PWP Package
28-Pin HTSSOP With Exposed Thermal Pad
TPS4H160-Q1 Version A Top View
NC – No internal connection
PWP Package
28-Pin HTSSOP With Exposed Thermal Pad
TPS4H160-Q1 Version B Top View
NC – No internal connection

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
VERSION A VERSION B
CL 11 11 O Adjustable current limit. Connect to device GND if external current limit is not used.
CS — 10 O Current-sense output
DIAG_EN 14 14 I Enable-disable pin for diagnostics; internal pulldown
FAULT — 9 O Global fault report with open-drain structure, ORed logic for quad-channel fault conditions
GND 1, 12 1, 12 — Ground pin
IN1 3 3 I Input control for channel 1 activation; internal pulldown
IN2 4 4 I Input control for channel 2 activation; internal pulldown
IN3 5 5 I Input control for channel 3 activation; internal pulldown
IN4 6 6 I Input control for channel 4 activation; internal pulldown
NC 2, 19, 24 2, 19, 24 — No internal connection
ST1 7 — O Open-drain diagnostic status output for channel 1
ST2 8 — O Open-drain diagnostic status output for channel 2
ST3 9 — O Open-drain diagnostic status output for channel 3
ST4 10 — O Open-drain diagnostic status output for channel 4
SEH — 7 I CS channel-selection high bit; internal pulldown
SEL — 8 I CS channel-selection low bit; internal pulldown
THER 13 13 I Thermal shutdown behavior control, latch off or auto-retry; internal pulldown
OUT1 27, 28 27, 28 O Output of the channel 1 high side-switch, connected to the load
OUT2 25, 26 25, 26 O Output of the channel 2 high side-switch, connected to the load
OUT3 17, 18 17, 18 O Output of the channel 3 high side-switch, connected to the load
OUT4 15, 16 15, 16 O Output of the channel 4 high side-switch, connected to the load
VS 20, 21, 22, 23 20, 21, 22, 23 I Power supply
Thermal pad — — — Connect to device GND or leave floating
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