ZHCSQC2A November   2015  – July 2022 TPS51216-EP

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 说明（续）
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 VDDQ Switch Mode Power Supply Control
      2. 8.3.2 VREF and REFIN, VDDQ Output Voltage
      3. 8.3.3 Soft-Start and Powergood
      4. 8.3.4 Power State Control
      5. 8.3.5 Discharge Control
      6. 8.3.6 VTT Overcurrent Protection
      7. 8.3.7 V5IN Undervoltage Lockout (UVLO) Protection
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 MODE Pin Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 D-CAP Mode
      2. 9.1.2 Light-Load Operation
      3. 9.1.3 VTT and VTTREF
      4. 9.1.4 VDDQ Overvoltage and Undervoltage Protection
      5. 9.1.5 VDDQ Overcurrent Protection
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 List of Materials
        2. 9.2.2.2 External Components Selection
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 接收文档更新通知
    2. 12.2 支持资源
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 术语表
  13. 13Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1)TPS51216-EPUNIT
RUK (WQFN)
20 PINS
RθJAJunction-to-ambient thermal resistance94.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance58.1°C/W
RθJBJunction-to-board thermal resistance64.3°C/W
ψJTJunction-to-top characterization parameter31.8°C/W
ψJBJunction-to-board characterization parameter58.0°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance5.9°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
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