ZHCSLU8A September   2020  – October 2020 TPS51397A

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Operation and DCAP3 Control
      2. 7.3.2 Soft Start
      3. 7.3.3 Large Duty Operation
      4. 7.3.4 Power Good
      5. 7.3.5 Overcurrent Protection and Undervoltage Protection
      6. 7.3.6 Overvoltage Protection
      7. 7.3.7 UVLO Protection
      8. 7.3.8 Output Voltage Discharge
      9. 7.3.9 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Light Load Operation
      2. 7.4.2 Advanced Eco-mode Control
      3. 7.4.3 Out-of-Audio
      4. 7.4.4 Mode Selection
      5. 7.4.5 Standby Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Component Selection
          1. 8.2.2.1.1 Output Voltage Set Point
          2. 8.2.2.1.2 MODE Selection
          3. 8.2.2.1.3 Inductor Selection
          4. 8.2.2.1.4 Output Capacitor Selection
          5. 8.2.2.1.5 Input Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 支持资源
    3. 11.3 Trademarks
    4. 11.4 静电放电警告
    5. 11.5 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)TPS51397AUNIT
RJE (VQFN)
20 PINS
RθJAJunction-to-ambient thermal resistance49.7°C/W
RθJA_effectiveJunction-to-ambient thermal resistance (4-layer custom board)(2)39.6°C/W
RθJC(top)Junction-to-case (top) thermal resistance26.2°C/W
RθJBJunction-to-board thermal resistance14.4°C/W
ψJTJunction-to-top characterization parameter0.9°C/W
ψJBJunction-to-board characterization parameter14.3°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance13.0°C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.
(2) 70 mm x 70 mm, 4 layers, thickness: 1.5 mm. 2 oz. copper traces located on the top and bottom of the PCB. 4 thermal vias in the PowerPAD area under the device package.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |