ZHCSTR3B December   2010  – November 2023 TPS53315

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  D-CAP™ Integrated Circuit with Adaptive On-Time
      2. 6.3.2  Small Signal Model
      3. 6.3.3  Ramp Signal
      4. 6.3.4  Auto-Skip Eco-mode Light Load Operation
      5. 6.3.5  Adaptive Zero Crossing
      6. 6.3.6  Forced Continuous Conduction Mode
      7. 6.3.7  Power Good
      8. 6.3.8  Current Sense and Overcurrent Protection
      9. 6.3.9  Overvoltage and Undervoltage Protection
      10. 6.3.10 UVLO Protection
      11. 6.3.11 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Enable and Soft Start
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Typical Application Circuit Diagram
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Step 1: Select Operation Mode and Soft-Start Time
          2. 7.2.1.2.2 Step 2: Select Switching Frequency
          3. 7.2.1.2.3 Step 3: Select the Inductance
          4. 7.2.1.2.4 Step 4: Select Output Capacitors
          5. 7.2.1.2.5 Step 5: Determine the Voltage-Divider Resistance (R1 and R2)
          6. 7.2.1.2.6 Step 6: Select the Overcurrent Resistance (RTRIP)
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Typical Application Circuit Diagram With Ceramic Output Capacitors
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Step 1: Select Operation Mode and Soft-Start Time
          2. 7.2.2.2.2 Step 2: Select Switching Frequency
          3. 7.2.2.2.3 Step 3: Select the Inductance
          4. 7.2.2.2.4 Step 4: Select Output Capacitance for Ceramic Capacitors
          5. 7.2.2.2.5 Step 5: Select the Overcurrent Setting Resistance (RTRIP)
        3. 7.2.2.3 External Component Selection When Using All Ceramic Output Capacitors
        4. 7.2.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 Thermal Considerations
  9. 8 Device and Documentation Support
    1. 8.1 接收文档更新通知
    2. 8.2 支持资源
    3. 8.3 Trademarks
    4. 8.4 静电放电警告
    5. 8.5 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

9 Revision History

Changes from Revision A (December 2015) to Revision B (November 2023)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 更新了商标信息Go
  • 更新了封装信息 表Go
  • 在简化应用图中的 VOUT 和 VFB 之间添加了电阻器Go

Changes from Revision * (May 2013) to Revision A (December 2015)

  • 添加了 ESD 等级 表、特性说明 部分、器件功能模式、应用和实施 部分、电源相关建议 部分、布局 部分、器件和文档支持 部分以及机械、封装和可订购信息 部分Go
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