SLVSAU2C May 2011 – December 2015 TPS54227
PRODUCTION DATA.
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Power Supply Recommendations
- 10Layout
- 11Device and Documentation Support
- 12Mechanical, Packaging, and Orderable Information
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机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
- DDA|8
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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)| MIN | MAX | UNIT | ||
|---|---|---|---|---|
| Input voltage | VIN, EN | –0.3 | 20 | V |
| VBST | –0.3 | 26 | V | |
| VBST (10-ns transient) | –0.3 | 28 | V | |
| VBST (vs SW) | –0.3 | 6.5 | V | |
| VFB, SS | –0.3 | 6.5 | V | |
| SW | –2 | 20 | V | |
| SW (10-ns transient) | –3 | 22 | V | |
| Output voltage | VREG5 | –0.3 | 6.5 | V |
| GND | –0.3 | 0.3 | V | |
| Voltage from GND to thermal pad, Vdiff | –0.2 | 0.2 | V | |
| Operating junction temperature, TJ | –40 | 150 | °C | |
| Storage temperature, Tstg | –55 | 150 | °C | |
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
| VALUE | UNIT | |||
|---|---|---|---|---|
| V(ESD) | Electrostatic discharge | Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V |
| Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±500 | |||
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)6.4 Thermal Information
| THERMAL METRIC(1) | TPS54227 | UNIT | ||
|---|---|---|---|---|
| DDA (HSOP) | DRC (VSON) | |||
| 8 PINS | 10 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 45.3 | 43.9 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 54.8 | 55.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 16.2 | 18.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 6.6 | 0.7 | °C/W |
| ψJB | Junction-to-board characterization parameter | 16 | 19.1 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | 8.5 | 5.3 | °C/W |
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
6.5 Electrical Characteristics
over operating free-air temperature range, VIN = 12 V (unless otherwise noted)| PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |
|---|---|---|---|---|---|---|
| SUPPLY CURRENT | ||||||
| IVIN | Operating - non-switching supply current | VIN current, TA = 25°C, EN = 5 V, VFB = 0.8 V | 800 | 1200 | μA | |
| IVINSDN | Shutdown supply current | VIN current, TA = 25°C, EN = 0 V | 5 | 10 | μA | |
| LOGIC THRESHOLD | ||||||
| VENH | EN high-level input voltage | EN | 1.6 | V | ||
| VENL | EN low-level input voltage | EN | 0.6 | V | ||
| REN | EN pin resistance to GND | VEN = 12 V | 220 | 440 | 880 | kΩ |
| VFB VOLTAGE AND DISCHARGE RESISTANCE | ||||||
| VFBTH | VFB threshold voltage | TA = 25°C, VO = 1.05 V, continuous mode | 749 | 765 | 781 | mV |
| IVFB | VFB input current | VFB = 0.8 V, TA = 25°C | 0 | ±0.1 | μA | |
| VREG5 OUTPUT | ||||||
| VVREG5 | VREG5 output voltage | TA = 25°C, 6 V < VIN < 18 V, 0 < IVREG5 < 5 mA | 5.2 | 5.5 | 5.7 | V |
| VLN5 | Line regulation | 6 V < VIN < 18 V, IVREG5 = 5 mA | 25 | mV | ||
| VLD5 | Load regulation | 0 mA < IVREG5 < 5 mA | 100 | mV | ||
| IVREG5 | Output current | VIN = 6 V, VREG5 = 4 V, TA = 25°C | 60 | mA | ||
| MOSFET | ||||||
| RDS(on)h | High-side switch resistance (DDA) | 25°C, VBST - SW = 5.5 V | 155 | mΩ | ||
| High-side switch resistance (DRC) | 165 | |||||
| RDS(on)l | Low-side switch resistance | 25°C | 108 | mΩ | ||
| CURRENT LIMIT | ||||||
| Iocl | Current limit | L out = 2.2 μH(1) | 2.5 | 3.3 | 4.7 | A |
| THERMAL SHUTDOWN | ||||||
| TSDN | Thermal shutdown threshold | Shutdown temperature (1) | 165 | °C | ||
| Hysteresis (1) | 35 | |||||
| ON-TIME TIMER CONTROL | ||||||
| tON | ON-time | VIN = 12 V, VO = 1.05 V | 150 | ns | ||
| tOFF(MIN) | Minimum OFF-time | TA = 25°C, VFB = 0.7 V | 260 | 310 | ns | |
| SOFT-START | ||||||
| ISSC | SS charge current | VSS = 1V | 1.4 | 2 | 2.6 | μA |
| ISSD | SS discharge current | VSS = 0.5 V | 0.1 | 0.2 | mA | |
| UVLO | ||||||
| UVLO | UVLO threshold | Wake up VREG5 voltage | 3.45 | 3.75 | 4.05 | V |
| Hysteresis VREG5 voltage | 0.13 | 0.32 | 0.48 | |||
(1) Not production tested.
6.6 Typical Characteristics
VIN = 12 V, TA = 25°C (unless otherwise noted)
Figure 3. EN Current vs EN Voltage
Figure 5. Switching Frequency vs Input Voltage
Figure 7. Vfb Voltage vs Junction Temperature
Figure 2. VIN Shutdown Current vs Junction Temperature
Figure 4. Efficiency vs Output Current
Figure 6. Switching Frequency vs Output Current