米6体育平台手机版

ZHCS048A June 2011 – July 2022 TPS54325-Q1

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		PWP	UNIT
THERMAL METRIC⁽¹⁾		14 PINS	UNIT
R _θJA	Junction-to-ambient thermal resistance	46.3	°C/W
R _θJC(top)	Junction-to-case (top) thermal resistance	36.6	°C/W
R _θJB	Junction-to-board thermal resistance	31.4	°C/W
ψ _JT	Junction-to-top characterization parameter	1.7	°C/W
ψ _JB	Junction-to-board characterization parameter	31.1	°C/W
R _θJC(bot)	Junction-to-case (bottom) thermal resistance	7.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.