This PowerPAD™ package incorporates an exposed thermal pad that is designed to be connected to an external heatsink. The thermal pad must be soldered directly to the printed board (PCB). After soldering, the PCB can be used as a heatsink. In addition, through the use of thermal vias, the thermal pad can be attached directly to the appropriate copper plane shown in the electrical schematic for the device, or alternatively, can be attached to a special heatsink structure designed into the PCB. This design optimizes the heat transfer from the integrated circuit (IC).

For additional information on the PowerPAD™ package and how to use the advantage of its heat dissipating abilities, refer to the PowerPAD™ Thermally Enhanced Package and PowerPAD Made Easy application notes.

The exposed thermal pad dimensions for this package are shown in the following illustration.

Figure 10-2 Thermal Pad Dimensions